Substrate processing apparatus and substrate processing method

Abstract

Provided are a substrate processing device and a substrate processing method. The substrate processing apparatus includes: a chamber, a substrate support member provided in the chamber for supporting a substrate, a spray member for supplying a rinse liquid to the substrate, a decompression line for decompressing the chamber, and a controller that controls After supplying the flushing liquid, the chamber is depressurized through the decompression line to vaporize the flushing liquid.

Description

technical field [0001] Embodiments of the inventive concept relate to a substrate processing apparatus and a substrate processing method. Background technique [0002] In order to manufacture semiconductor devices and liquid crystal display panels, various processes such as a photolithography process, an etching process, an ashing process, a thin film deposition process, and a cleaning process are performed. Among these processes, an etching process is used to remove unnecessary regions from a thin film formed on a substrate, and the etching process requires a higher selectivity with respect to the thin film and a higher etching rate. [0003] Generally, the etching process or cleaning process is mainly performed by sequentially performing a chemical treatment step, a rinse treatment step, and a drying treatment step. According to the chemical treatment step, a thin film formed on the substrate is etched or chemicals are supplied to the substrate to remove foreign substance...

AI Technical Summary

Problems solved by technology

As finer patterns are formed on the substrate, the risk of breaking the pattern due to surface tension may increase

Images