Preparation method of touch display screen and bonding device

A technology of touch screen and bonding equipment, applied in the input/output process of data processing, instruments, electrical digital data processing and other directions, can solve problems such as low production efficiency, improve production efficiency, reduce manufacturing costs, and save time effect of time

Pending Publication Date: 2018-12-04
LENS TECH CHANGSHA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The first purpose of the present invention is to provide a method for preparing a touch display screen, so as to alleviate the technical problem of low production efficiency in the prior art of laminating with vacuum

Method used

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  • Preparation method of touch display screen and bonding device
  • Preparation method of touch display screen and bonding device
  • Preparation method of touch display screen and bonding device

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preparation example Construction

[0045]The preparation method of the touch screen provided by the present invention is to bond the touch screen and the TFT module in a non-vacuum state by extrusion, and the touch screen and the TFT module can be squeezed to Bubble discharge, this method can be realized in a non-vacuum state, and does not need to evacuate the equipment, thereby saving evacuation time and improving production efficiency.

[0046] In addition, the present invention innovatively adopts an extrusion method to bond the touch screen and the TFT module in a non-vacuum state, which is completely different from the traditional method of bonding using vacuum processing. Productivity provides new ideas.

[0047] The non-vacuum state referred to in the present invention refers to a normal pressure state. Atmospheric pressure is an atmospheric pressure, which is the gas pressure produced by the atmosphere in which we usually live. The non-vacuum state adopted in the present invention is relative to the t...

Embodiment 1

[0107] A method for preparing a touch screen, comprising the steps of:

[0108] Step a): Obtain the film sensor 421 through processes such as photolithography, screen printing or laser;

[0109] Step b): Use hot pressing technology to assemble the thin film sensor 421 prepared in step a) and the flexible circuit board 422 into the FOG module 42; when hot pressing, the hot pressing pressure is 2MPa, the hot pressing temperature is 155°C and the hot pressing time is 9s;

[0110] Step c): The FOG module 42 prepared in step b) and the glass cover 41 are assembled into a touch screen 40 by using the L-shaped alignment bonding technology; when L-shaped alignment bonding is performed, the pressure is 0.4 MPa, and the bonding speed is 145 mm / s; the L-shaped alignment bonding technology in this process adopts the soft-to-hard bonding technology;

[0111] Step d): one side of the optical adhesive 43 is bonded to the FOG module 42 surface of the touch screen 40 prepared in step c) usi...

Embodiment 2

[0115] A method for preparing a touch screen, comprising the steps of:

[0116] Step a): Obtain the film sensor 421 through processes such as photolithography, screen printing or laser;

[0117] Step b): Assemble the thin film sensor 421 prepared in step a) and the flexible circuit board 422 into a FOG module 42 using hot pressing technology; when hot pressing, the hot pressing pressure is 2.3MPa, the hot pressing temperature is 160°C and the hot pressing time is 10s;

[0118] Step c): The FOG module 42 prepared in step b) and the glass cover 41 are assembled into a touch screen 40 by using the L-shaped alignment bonding technology; when L-shaped alignment bonding is performed, the pressure is 0.45 MPa, and the bonding speed is 150 mm / s; the L-shaped alignment bonding technology in this process adopts the soft-to-hard bonding technology;

[0119] Step d): Bond one side of the optical adhesive 43 with the FOG module 42 of the touch screen 40 prepared in step c) using the CCD...

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Abstract

The invention provides a preparation method of a touch display screen and a bonding device and relates to the technical field of the preparation of an electronic device display screen. The method comprises a step of bonding a touch screen and a TFT module in a non-vacuum state by using a pressing mode. According to the preparation method and the bonding device, the technical problem of low efficiency in bonding production by using vacuum in the prior art is alleviated, and a technical effect of improving the production efficiency is achieved.

Description

technical field [0001] The invention relates to the technical field of preparation of display screens of electronic equipment, in particular to a preparation method and bonding equipment of touch display screens. Background technique [0002] TFT (Thin Film Transistor) is the abbreviation of thin film transistor. Each liquid crystal pixel on the TFT display is driven by a thin film transistor integrated behind the pixel, so the TFT display is also a type of active matrix liquid crystal display device, which is the best LCD (Liquid Crystal Display, liquid crystal display) ) One of the color displays, the TFT display has the advantages of high responsivity, high brightness, and high contrast. At the same time, TFT screens are also widely used in mid-to-high-end color screen mobile phones, and their display effects are very good. [0003] With the rapid development of electronic equipment and the touch control of electronic display products, more and more touch screen and LCD...

Claims

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Application Information

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IPC IPC(8): G06F3/041
CPCG06F3/0412G06F2203/04103
Inventor 饶桥兵曹忠周腾
Owner LENS TECH CHANGSHA
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