Compound type LCP (Liquid-Crystal Polymer) high-frequency high-speed double-sided copper foil substrate and preparation method thereof

Abstract

The invention discloses a compound type LCP (Liquid-Crystal Polymer) high-frequency high-speed double-sided copper foil substrate. The compound type LCP high-frequency high-speed double-sided copper foil substrate comprises one or more LCP core layer, one or more extremely-low dielectric adhesive layer and two copper foil layers, the LCP core layer and the extremely-low dielectric adhesive layer are arranged between the two copper foil layers, wherein the thickness of the each LCP core layer is 5 to 50 micronmeters; the thickness of the each extremely-low dielectric adhesive layer is 2 to 50 micrometers; the thickness of the each copper foil layer is 1 to 35 micrometers, the extremely-low dielectric adhesive layers are adhesive layers of which Dk values are 2.0 to 3.0 (10GHz) and Df valuesare 0.002 to 0.010 (10GHz). The compound type LCP high-frequency high-speed double-sided copper foil substrate disclosed by the invention has the advantages of good electricity, low roughness, stabledk / df performance under a high-temperature moisture environment, ultra-low water absorption rate, good UV laser drilling ability, low rebounding force for high-density assembly and excellent mechanical performance; in addition, based on a current coating technology, the coating thickness of about 50 micrometers at most only can be required. According to the preparation method disclosed by the invention, the substrate, of which the thickness is 100 micrometers or above, can be easily obtained.

Description

technical field [0001] The invention relates to the technical field of a double-sided copper foil substrate for FPC (flexible circuit board) and its preparation, in particular to a composite LCP high-frequency and high-speed double-sided copper foil substrate. Background technique [0002] With the rapid development of information technology, in order to meet the needs of high-frequency and high-speed signal transmission, rapid heat dissipation and heat conduction, and minimum production costs, the design and application of various forms of mixed-pressure multilayer boards have emerged as the times require. Printed circuit boards are an indispensable material in electronic products, and as the demand for consumer electronics grows, the demand for printed circuit boards is also increasing. Due to the flexible printed circuit board (FPC, Flexible Printed Circuit) has the characteristics of flexibility and three-dimensional space wiring, under the development trend of technolog...

AI Technical Summary

Problems solved by technology

[0005] General epoxy resin-based products do not perform well in the downstream industry’s small-aperture (less than 100um) UV laser processing, and are likely to cause shrinkage of the through-hole (PTH, Plating Through Hole), so they are only suitable for larger apertures. Mechanical drilling method

[0006] In the preparation of multi-layer boards and soft-rigid boards, due to the high hygroscopicity (1-2%) of the general PI (polyimide) type and TPI type copper foil substrates, there will be board bursting problems, which seriously affects the good quality. Rate

[0007] In terms of cost, performance and workability, high-frequency substrates are prepared by LCP and TPI (thermosetting polyimide) methods, which require high-temperature lamination, and the lamination temperature is between 280-330°C, especially in production and transmission performance For products with a thickness above 38μm, the efficiency is low and the cost is high

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