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Method for preparing gradient silicon steel thin strip through normal-temperature electro-deposition-expansion percolation and special plating solution

A technology of electrodeposition and pulse electrodeposition, applied in the field of metal surface treatment, can solve the problems of production and application constraints of silicon steel thin strip with high Si content

Active Publication Date: 2018-11-16
SUZHOU UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the Si content in silicon steel strips widely used today is mostly ≤3.5wt%, and there are serious technical constraints in the production and application of high Si content silicon steel strips

Method used

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  • Method for preparing gradient silicon steel thin strip through normal-temperature electro-deposition-expansion percolation and special plating solution
  • Method for preparing gradient silicon steel thin strip through normal-temperature electro-deposition-expansion percolation and special plating solution
  • Method for preparing gradient silicon steel thin strip through normal-temperature electro-deposition-expansion percolation and special plating solution

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] Take some low-silicon steel thin strips of 20×10×0.1mm, polish the surface with metallographic sandpaper, pickle with hydrochloric acid first, then ultrasonically clean with deionized water, absolute ethanol and acetone in sequence, dry, and put it in a desiccator for later use . The treated low-silicon steel strip will serve as a substrate for electrodeposition.

[0034] Prepare the plating solution, the composition of the plating solution is: FeCl 2 0.4mol·L -1 , SiCl 4 0.02mol·L -1 , C 19 h 42 ClN0.002mol L -1 , C 16 h 36 ClN 0.08mol L -1 , and the balance is the solvent propylene carbonate. The plating solution was left to age for 36h.

[0035] The previously pretreated low-silicon steel strip was used as the cathode, and the carbon rod was used as the anode. The distance between the cathode and the anode was 2 cm, the electrodeposition temperature was 40 ° C, and the average cathode current density was 40 mA cm -2 , the duty cycle of the pulse current i...

Embodiment 2

[0039] Process the low silicon steel thin strip according to the method of embodiment 1.

[0040] Prepare the plating solution, the composition of the plating solution is: FeCl 2 4H 2 O 0.5mol L -1 , SiCl 4 0.03mol·L -1 , C 19 h 42 ClN0.015mol L -1 , C 16 h 36 ClN 0.07mol L -1, and the balance is the solvent propylene carbonate. The plating solution was left to age for 36h.

[0041] The previously pretreated low-silicon steel strip was used as the cathode, and the carbon rod was used as the anode. The distance between the cathode and the anode was 5 cm, the electrodeposition temperature was 40 ° C, and the average cathode current density was 120 mA cm -2 , the duty cycle of the pulse current is 60%, the pulse frequency is 1200Hz, and the electrodeposition time is 10min.

[0042] The thermal expansion and infiltration treatment method is the same as in Example 1.

[0043] The analysis, characterization and performance test methods of the samples are the same as in ...

Embodiment 3

[0045] Process the low silicon steel thin strip according to the method of embodiment 1.

[0046] Prepare plating solution, and plating solution is composed with embodiment 1. The plating solution was left to age for 36h.

[0047] The previously pretreated low-silicon steel strip was used as the cathode, and the carbon rod was used as the anode. The distance between the cathode and the anode was 5 cm, and the electrodeposition temperature was 40°C.

[0048] The average cathode current density, pulse current duty ratio, pulse frequency, ultrasonic power, ultrasonic frequency, and electrodeposition time of the electrodeposition process are the same as in Example 2.

[0049] Then place the low-silicon steel strip with the Fe-Si alloy layer deposited on the surface in a reducing atmosphere furnace for thermal expansion and infiltration treatment, the atmosphere is H 2 / Ar mixed gas [V(H 2 ) / V(Ar)=8%], the heating rate is 10°C / min, the heat treatment temperature is 1000°C, and t...

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Abstract

The invention discloses a method for preparing a gradient silicon steel thin strip through normal-temperature electro-deposition-expansion percolation and a special plating solution. The method is characterized by comprising the following steps: taking a low-silicon steel thin strip as a cathode plated part, taking tetrabutyl ammonium chloride as supporting electrolyte in a propylene carbonate system which is dissolved with SiCl4, FeCl2 and / or hydrate thereof, and performing electro-deposition preparation on a Fe-Si alloy layer for the cathode plated part through a pulse electro-deposition method in an anhydrous oxygen-free environment; putting into a reducing atmosphere furnace, performing thermal expansion percolation treatment, and enabling Si to effectively percolate into a substrate surface layer, thereby preparing the gradient silicon steel thin strip. The method adopts the electro-deposition method and a thermal treatment process to perform surface treatment on the low-silicon steel thin strip, realizes secondary adding of Si of the common low-silicon steel thin strip surface layer, prepares the gradient high silicon steel thin strip, and is simple and efficient.

Description

technical field [0001] The invention belongs to the technical field of metal surface treatment, and relates to a method for preparing an alloy coating on a metal surface and diffusing coating elements to the core metal, in particular to a method for preparing a gradient silicon steel thin strip by normal temperature electrodeposition-diffusion infiltration and its special purpose Plating solution. Background technique [0002] In the manufacture of transformers and motors, silicon steel thin strips account for 90-95% of the soft magnetic materials by weight, and are the most used soft magnetic alloys. In recent years, with the continuous improvement of the portability of electrical equipment and the weight reduction requirements of new vehicles such as electric vehicles and powered aircraft, the miniaturization and weight reduction of transformers and motors is becoming the goal of people's efforts. Theory and practice show that high frequency is the key way to reduce the s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/56C25D5/18C25D5/50
Inventor 盛敏奇吴琼吕凡许继芳翁文凭
Owner SUZHOU UNIV
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