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Application of graphite in preparation of chip cooling heat sink material

A chip heat dissipation and graphite technology, applied in electrical components, electrical solid devices, circuits, etc., can solve the problem of heat accumulation and other problems, and achieve the effect of low cost and simple preparation process

Inactive Publication Date: 2018-11-06
深圳市恒川激光技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a kind of application of graphite in the preparation of chip heat sink material, adopt specific technology to process graphite, make it be used for chip heat sink substrate material, solve the problem of existing heat sink substrate The material does not address the drawback of heat build-up as the chip is injected with more energy

Method used

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  • Application of graphite in preparation of chip cooling heat sink material

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Embodiment Construction

[0018] In order to fully understand the technical content of the present invention, the technical solutions of the present invention will be further introduced and illustrated below in conjunction with specific examples, but not limited thereto.

[0019] The invention provides an application of graphite in the preparation of heat sink materials for chips. Graphite is used as the heat sink substrate material for chips. The crystal lamellar structure of graphite determines that its thermal conductivity in a specific direction is very high, and its heat capacity The value is very low, there is no heat accumulation phenomenon, and heat can be quickly transferred to surrounding substances, including air. Specifically, the performance list of the graphite compared with the main heat sink substrate materials at this stage is as follows:

[0020]

[0021] Specifically, the graphite of the present invention is mainly used as a heat sink substrate material for chips with high injectio...

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Abstract

The invention relates to the technical field of a chip cooling heat sink material, in particular to application of graphite in preparation of the chip cooling heat sink material. The graphite is processed by a special process, so that the graphite is used for the chip cooling heat sink substrate material, the heat conduction coefficient of the graphite in a horizontal direction is determined to bevery high by a crystal piece layer structure, the heat capacity value is very low, no heat accumulation phenomenon is generated, and heat can be rapidly conducted to a surrounding substance comprising air; and moreover, the graphite preparation process is simple and is low in cost.

Description

technical field [0001] The invention relates to the technical field of chip heat dissipation heat sink materials, in particular to the application of graphite in the preparation of chip heat dissipation heat sink materials. Background technique [0002] The accumulation of heat in the core chip of power devices has always been a problem that plagues the development of chips, such as wave amplifier chips for communication and semiconductor laser chips. *In the chip volume of 1mm, 60A*1.5V power injection results in high power density and heat concentration, which affects the performance and life of the chip. [0003] The main way to solve this problem at this stage is: bonding or brazing the chip on the heat dissipation heat sink material. The heat sink material mainly used is heat sink lining of gallium arsenide, copper, sapphire, aluminum nitride and other materials. At the bottom, however, these materials cannot better solve the problem of heat accumulation brought about ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/373
CPCH01L23/3735
Inventor 何斌罗炜
Owner 深圳市恒川激光技术有限公司
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