Aluminum-silicon/aluminum-silicon carbide gradient composite material and preparation method thereof

Abstract

The invention relates to an aluminum silicon / aluminum silicon carbide gradient composite material and a preparation method thereof. The aluminum silicon / aluminum silicon carbide gradient composite material is the gradient composite material composed of at least one aluminum silicon alloy layer and at least one aluminum silicon carbide composite material layer; wherein, by weight percentage, the aluminum silicon alloy layer contains 22-50% of silicon and the balance aluminum; by volume percentage, the aluminum silicon carbide composite material layer comprises 40-65% of silicon carbide and thebalance aluminum or aluminum alloy. The aluminum silicon / aluminum silicon carbide gradient composite material has the advantages of being high in thermal conductivity, high in mechanical strength, lowin density, controllable in performance, easy to process, low in cost, and high in comprehensive performance, the various indicator requirements of electronic packaging can be met, and the aluminum silicon / aluminum silicon carbide gradient composite material is especially suitable for the electronic packaging materials.

Description

technical field [0001] The invention relates to the technical field of composite materials, in particular to an aluminum-silicon / aluminum-silicon carbide gradient composite material and a preparation method thereof. Background technique [0002] Electronic packaging materials are base materials used to carry electronic devices and their interconnections, and play the roles of mechanical support, sealing environment protection, signal transmission, heat dissipation and shielding. There are many types of electronic packaging materials. Traditional metal-based or ceramic electronic packaging materials mainly include Cu, Al, Ti, Kovar, W / Cu, Mo / Cu, Al / SiC, Al 2 o 3 , AlN, etc. With the development of modern electronic systems in the direction of miniaturization, light weight, high operating frequency, high power density, multi-function and high reliability, traditional electronic packaging materials are no longer competent in terms of thermal expansion coefficient matching, li...

AI Technical Summary

Problems solved by technology

With the development of modern electronic systems in the direction of miniaturization, light weight, high operating frequency, high power density, multi-function and high reliability, traditional electronic packaging materials are no longer competent in terms of thermal expansion coefficient matching, light weight and hermetic welding.

[0003] Studies have shown that the failure rate of electronic devices increases sharply with the increase of operating temperature: Basically, for every 10°C increase in operating temperature, the life of GaAs or Si semiconductor devices will decrease by one-third

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