electronic device

Abstract

The electronic device of the present invention comprises: a substrate 5; a first conductor layer 71 disposed on the substrate 5; a second conductor layer 72 disposed on the substrate 5; an electronic element 95 disposed on the first conductor layer 71; and the substrate 5. The package portion 90 covered by the first conductor layer 71, the second conductor layer 72, and the electronic component 95, wherein the in-plane direction of the substrate 5, that is, the imaginary straight line VL including the second conductor layer 72 is not arranged with the first conductor layer 72. The first conductor layer 71 and the second conductor layer 72 are only covered by the encapsulation portion 90 while being enclosed in the encapsulation portion 90 .

Description

technical field [0001] The present invention relates to electronic devices. Background technique [0002] Conventionally, a semiconductor element as an electronic element is placed on a conductive layer of a substrate, and the surface of the semiconductor element and the terminal are connected with a bonding wire or a connector by solder or the like, and the conductive layer, semiconductor element, bonding wire, etc. Such an electronic device is widely known as an example of a semiconductor device in which a package such as a connector and the like is packaged with a package such as a package resin (see Japanese Patent Application Laid-Open No. 2014-195064). In such a semiconductor device, if the region where the conductor layer is not disposed on the substrate becomes longer, the warpage of the substrate may increase. [0003] In view of the above problems, an object of the present invention is to provide an electronic device capable of preventing the warpage of the substr...

AI Technical Summary

Problems solved by technology

In such a semiconductor device, if the region where the conductor layer is not arranged on the substrate becomes longer, the warpage of the substrate may increase.

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