Electronic device

Abstract

This electronic device is provided with: a substrate 5; a plurality of first conductor layers 71 provided on the substrate 5; second conductor layers 72 provided on the substrate 5; electronic elements 95 provided to the first conductor layers 71; and a sealing part 90 which covers the substrate 5, the first conductor layers 71, the second conductor layers 72, and the electronic elements 95. The first conductor layers 71 are not provided on a virtual line VL which includes the second conductor layers 72, and which extends in an in-plane direction of the substrate 5. The second conductor layers72 are sealed inside the sealing part 90, and are only covered by the sealing part 90.

Description

technical field [0001] The present invention relates to electronic devices. Background technique [0002] Conventionally, a semiconductor element as an electronic element is placed on a conductive layer of a substrate, and the surface of the semiconductor element and the terminal are connected with a bonding wire or a connector by solder or the like, and the conductive layer, semiconductor element, bonding wire, etc. Such an electronic device is widely known as an example of a semiconductor device in which a package such as a connector and the like is packaged with a package such as a package resin (see Japanese Patent Application Laid-Open No. 2014-195064). In such a semiconductor device, if the region where the conductor layer is not disposed on the substrate becomes longer, the warpage of the substrate may increase. [0003] In view of the above problems, an object of the present invention is to provide an electronic device capable of preventing the warpage of the substr...

AI Technical Summary

Problems solved by technology

In such a semiconductor device, if the region where the conductor layer is not arranged on the substrate becomes longer, the warpage of the substrate may increase.

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