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Epoxy resin system, preparation method thereof and prepreg

An epoxy resin system and epoxy resin technology, applied in the field of composite materials, can solve the problems of unfavorable storage, transportation and use of prepregs, inability to store for a long time, low apparent activation energy, etc., and achieve stable, reliable and excellent performance. The effect of performance, simple preparation process

Inactive Publication Date: 2018-10-12
AEROSPACE RES INST OF MATERIAL & PROCESSING TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Patent CN102532484A discloses an epoxy resin mixture that can complete preliminary curing at 85°C, but the storage period of the prepreg prepared from this resin is 8 days at room temperature, which is short, which is not conducive to the storage and transportation of the prepreg and use
[0003] In addition, amine curing agents such as IPDA, DMDC, and polyetheramine D230 can cure epoxy resin at a temperature of 80°C or below, but the apparent activation energy of the curing reaction of the obtained resin system is often low, usually <70kJ / mol, and the curing The agent is in a liquid state, fully mixed with the resin, and cannot be stored for a long time at room temperature

Method used

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  • Epoxy resin system, preparation method thereof and prepreg
  • Epoxy resin system, preparation method thereof and prepreg
  • Epoxy resin system, preparation method thereof and prepreg

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0077] (1) Preparation of epoxy resin

[0078] Preparation of component A: Take 10kg of solid epoxy resin E-20 and 4kg of liquid epoxy resin E-51 in a reactor and heat to 100°C and stir for 60 minutes. The solid epoxy resin is completely melted and fully mixed with the liquid epoxy resin. Then the reactor was cooled to 55°C and kept warm.

[0079] Preparation of component B: Take 6kg of liquid epoxy resin E-51 and put it into a mixer, add 3.6kg of Thinkhard 608K and 1kg of PN-23J, stir for 40min, and then grind twice through a three-roll mill to obtain a uniform mixture.

[0080] Epoxy resin system preparation: Add component B into component A reactor and stir at 55°C for 60 minutes to obtain an epoxy resin system.

[0081] (2) Activation energy of curing reaction of resin system

[0082] Using Mettler-Toledo DSC1 to study the curing reaction of the resin system, the temperature range is 25 ~ 260 ° C, the heating rate is 5, 10, 15 and 20 ° C / min, the protection system is h...

Embodiment 2

[0092] (1) Preparation of epoxy resin

[0093] Preparation of component A: Take 4kg of solid epoxy resin E-20, 9kg of semi-solid novolak epoxy resin F-46 and 2kg of liquid epoxy resin E-51 in a reaction kettle, heat to 130°C and stir for 45min, wait for the solid and semi-solid The solid epoxy resin is completely melted and fully mixed with the liquid epoxy resin, and then the reaction kettle is cooled to 50°C to keep it warm.

[0094] Preparation of component B: Take 5kg of liquid epoxy resin E-51 and put it into a mixer, add 3.6kg of Thinkhard 608K and 1.2kg of PN-23J, stir for 50min, and then grind twice through a three-roll mill to obtain a uniform mixture.

[0095] Preparation of epoxy resin system: Add component B into component A reactor and stir at 50°C for 60 minutes to obtain an epoxy resin system.

[0096] (2) Activation energy of curing reaction of resin system

[0097] Adopt the method identical with embodiment 1, obtain the variation relation of activation ener...

Embodiment 3

[0105] (1) Preparation of epoxy resin

[0106] Preparation of component A: Take 5kg of four-functionality liquid epoxy resin S720 and 1.2kg of phenoxy resin JER4250 in a reaction kettle, heat to 130°C and stir for 90min. After the phenoxy resin is completely dissolved in the epoxy resin, add 6kg of solid Continue to stir the epoxy resin for 60 minutes. After the solid epoxy resin is completely melted and fully mixed, the reaction kettle is cooled to 60°C and kept warm.

[0107] Preparation of component B: Take 2kg of liquid epoxy resin E-51 and 5kg of liquid epoxy resin S720 and put them into the mixer, add 5kg of Thinkhard 608K and 1.2kg of PN-23J, stir for 50min, and then grind once with a three-roll mill A homogeneous mixture is obtained.

[0108] Preparation of epoxy resin system: Add component B into component A reactor and stir at 60°C for 25 minutes to obtain an epoxy resin system.

[0109] (2) Activation energy of curing reaction of resin system

[0110] Using the s...

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Abstract

The invention relates to an epoxy resin system, a preparation method thereof and a prepreg. The epoxy resin system comprises the following components: in parts by mass, 100 parts of main epoxy resin,5-50 parts of a powder curing agent and 0-20 parts of a toughening agent, wherein each 100 parts of the main epoxy resin comprises the following components: in parts by weight, 10-70 parts of liquid epoxy resin, X parts of semi-solid epoxy resin and Y parts of solid epoxy resin, 30<=X+Y<=90, and Y<=60; the average value Ea of the apparent activation energy of the epoxy resin system in a curing reaction is >=70 kJ / mol; through theoretical researches combined with a large number of experiments, by selecting the powder curing agent, the contact area of the curing agent with the epoxy resin can bereduced, and the apparent activation energy of the resin system in the curing reaction can be adopted as an important basis for the preferred resin system, so that the obtained epoxy resin system andthe prepreg prepared by using a hot-melt method are cured at a low temperature of 80 DEG C or below and cured rapidly within 10 min at 130-150 DEG C or below, and the storage period of the prepreg atroom temperature reaches 20 days or above.

Description

technical field [0001] The invention relates to an epoxy resin system, a preparation method and a prepreg, in particular to an epoxy resin system, a preparation method and a prepreg capable of low-temperature curing and medium-temperature rapid curing, belonging to the technical field of composite materials. Background technique [0002] Reducing the curing temperature of composite materials or shortening the molding time of composite materials can greatly save energy consumption and improve production efficiency, which in turn helps to expand the application range of resin-based composite materials. However, in practical applications, it is found that when the curing temperature of the composite material is lowered, the room temperature storage time of the prepreg is also greatly shortened, which brings difficulties to the storage and transportation of the prepreg and the manufacture of large composite components. Patent CN103113710A discloses a preparation method of an epo...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08L13/00C08L63/10C08L71/12C08K7/06C08J5/24C08G59/40C08G59/50
CPCC08G59/4014C08G59/50C08J5/24C08J2363/00C08J2413/00C08J2463/00C08J2463/10C08J2471/12C08K7/06
Inventor 蒋文革尚呈元樊孟金周宇凌辉张东霞臧千
Owner AEROSPACE RES INST OF MATERIAL & PROCESSING TECH
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