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Mask and fabrication method thereof

A manufacturing method and a technology of a mask plate, which are applied in semiconductor/solid-state device manufacturing, ion implantation plating, coating, etc., can solve the problems such as difficult cleaning of the mask plate, and achieve the effect of simple cleaning and preventing damage

Active Publication Date: 2018-09-28
BOE TECH GRP CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] Embodiments of the present invention provide a mask and its manufacturing method, which can solve the problem that the existing mask is difficult to clean

Method used

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  • Mask and fabrication method thereof
  • Mask and fabrication method thereof

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Embodiment Construction

[0021] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0022] An embodiment of the present invention provides a mask, such as figure 1 and figure 2 As shown, it includes: a mask substrate 11, the mask substrate 11 includes an opening area 111 and a shielding area 112; Region 112 ; the protective layer 13 disposed on the surface of the removable adhesive layer 12 away from the mask substrate 11 , the protective layer 13 covers the removable adhesive layer 12 .

[0023] refer to figure 1 As shown, the first surf...

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Abstract

The embodiment of the invention provides a mask and a fabrication method thereof, and relates to the field of an electronic component. By the mask and the fabrication method thereof, the problem thata traditional mask is relatively difficult to clean can be solved. The mask comprises a mask substrate, losable gluing layer and a protection layer, wherein the mask substrate comprises an opening region and a shielding region, the losable gluing layer is arranged on the first surface of the mask substrate and covers the shielding region, and the protection layer is arranged on a surface, far awayfrom the mask substrate, of the losable gluing layer and covers the losable gluing layer. The mask is used for fabricating a film layer.

Description

technical field [0001] The invention relates to the field of electronic components, in particular to a mask plate and a manufacturing method thereof. Background technique [0002] OLED (Organic Light-Emitting Diode, Organic Light-Emitting Diode, Organic Light-Emitting Diode) display device has gradually received widespread attention due to its ability to achieve a high color gamut, ultra-thin, and flexible display. Mask plates are required in each process of OLED production to achieve the purpose of patterning. Especially in the evaporation of the functional layer and the fabrication of the top electrode, the mask is an indispensable part. Due to the common processes such as evaporation, chemical vapor deposition, sputtering, etc., the film-forming material will remain on the mask plate, and with the accumulation of production time, the material will agglomerate and evolve into peeling off of pollutants, which will affect the production of devices , so the mask plate needs...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/56C23C14/04
CPCC23C14/042H10K71/166H10K71/621
Inventor 罗程远
Owner BOE TECH GRP CO LTD
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