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Polyimide containing fluorene or fluorenone structure as well as preparation method and application of polyimide

A technology of polyimide and polyimide film, applied in the field of material science, to achieve excellent barrier properties, simple preparation process, and low condition requirements

Inactive Publication Date: 2018-09-07
HUNAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The research focus of this system is to design and synthesize a new type of high-barrier polyimide containing fluorene or fluorenone structure with high molecular chain rigidity and small free volume. However, no one has studied it so far, so it is necessary to develop new Design and synthesis of high barrier polyimide with or fluorenone structure

Method used

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  • Polyimide containing fluorene or fluorenone structure as well as preparation method and application of polyimide
  • Polyimide containing fluorene or fluorenone structure as well as preparation method and application of polyimide
  • Polyimide containing fluorene or fluorenone structure as well as preparation method and application of polyimide

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] At room temperature, 4.3450g (0.01mol) N 2 ,N 7-bis(4-aminophenyl)-9H-fluorene-2,7-dicarboxamide (FAPDA) and 43.51g (46.1ml) N,N-dimethylformamide were added to a 100ml three-necked flask, argon was introduced, and stirred , after completely dissolving, add 2.1812g (0.01mol) Pyromellitic dianhydride (pyromellitic dianhydride, PMDA), continue to stir and react for 6h, and obtain a homogeneous, transparent, viscous polyamic acid glue. Then scrape and coat the polyamic acid solution on the glass plate, then place the glass plate in a vacuum oven, vacuumize, and the heating program is as follows: the temperature is raised from room temperature to 100°C, and then the whole process of constant temperature is 1h → 100°C is heated to 200°C, and then the whole process is constant Process 1h→200°C, heat up to 300°C and then keep constant temperature. The whole process 1h→300°C, heat up to 420°C, then keep constant temperature. The whole process is 1.5h. After cooling, the polyim...

Embodiment 2

[0040] At room temperature, 4.78g (0.01mol) 1,1'-(9-oxo-9H-fluorene-2,7-diyl)bis(3-(4-aminophenyl)urea) (FUPDA) and 45.51g (48.8ml )N,N-Dimethylformamide was added to a 100ml three-necked flask, argon was introduced, stirred, and after it was completely dissolved, 2.1812g (0.01mol) of Pyromellitic dianhydride (pyromellitic dianhydride, PMDA) was added, and continued After stirring for 6 hours, a homogeneous, transparent and viscous polyamic acid solution was obtained. Then scrape and coat the polyamic acid solution on the glass plate, then place the glass plate in a vacuum oven, vacuumize, and the heating program is as follows: the temperature is raised from room temperature to 100°C, and then the whole process of constant temperature is 1h → 100°C is heated to 200°C, and then the whole process is constant Process 1h→200°C, heat up to 300°C and then keep constant temperature. The whole process 1h→300°C, heat up to 420°C, then keep constant temperature. The whole process is 1.5...

Embodiment 3

[0044] At room temperature, 5.3068g (0.01mol) N 1 ,N 1 '-((9H-fluorene-2,7-diyl)bis(4,1-phenylene))bis(benzene-1,4-diamine)(FPIPDA) and 49.92g (52.85ml) N,N-dimethyl Formamide was added to a 100ml three-necked flask, argon was introduced, stirred, and after it was completely dissolved, 2.1812g (0.01mol) of pyromellitic dianhydride (pyromellitic dianhydride, PMDA) was added, and the stirring reaction was continued for 6h to obtain a homogeneous, Transparent, viscous polyamic acid solution. Then scrape and coat the polyamic acid solution on the glass plate, then place the glass plate in a vacuum oven, vacuumize, and the heating program is as follows: the temperature is raised from room temperature to 100°C, and then the whole process of constant temperature is 1h → 100°C is heated to 200°C, and then the whole process is constant Process 1h→200°C, heat up to 300°C and then keep constant temperature. The whole process 1h→300°C, heat up to 420°C, then keep constant temperature. T...

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Abstract

The invention discloses polyimide containing a fluorene or fluorenone structure as well as a preparation method and an application of polyimide. The polyimide material takes high-planarity aromatic diamine containing the fluorene or fluorenone structure and various tetracarboxylic dianhydrides as raw materials, and a powder material or film of polyimide is prepared through thermal imidization or chemical imidization. The lowest energy state structure of a diamine monomer has high planarity and higher rigidity, so that the prepared polyimide molecular chains are piled closely, and the preparedpolyimide film has excellent barrier performance, higher glass transition temperature and heat stability and lower thermal expansion coefficient. The synthesis method adopts a simple and diversified process and is thus suitable for industrial production. The polyimide can be widely applied to the field of high-tech industries such as micro-electronics, military industry, aerospace, high-performance packaging and protection, electronic device packaging and the like.

Description

[0001] This application is the patent number 2016100180408, the application date is: January 12, 2016, and the patent name is <>. technical field [0002] The invention relates to the field of material science, in particular to a novel polyimide containing a fluorene or fluorenone structure and a preparation method thereof. technical background [0003] As the supporting and protecting component of the entire flexible device, the performance of the flexible substrate has an important impact on the quality and life of the flexible display device. Therefore, domestic and foreign attach great importance to the research and development of flexible substrates. In general, the performance requirements of flexible display devices for substrate materials are mainly reflected in several aspects: (1) have excellent heat resistance and high temperature dimensional stability; (2) have good flexibility; (3) have very Excellent barrier properties, among them, LCD devices require mater...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/10C08J5/18C08L79/08
CPCC08G73/1007C08G73/1067C08G73/1071C08J5/18C08J2379/08
Inventor 刘亦武谭井华王倩
Owner HUNAN UNIV OF TECH
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