Plastic sealing method for solving problem of plastic sealing mold flow and widening wafer width

Abstract

The invention relates to a plastic sealing method for solving the problem of plastic sealing mold flow and widening the wafer width. The method comprises the following steps: designing a wafer circuit, and sidely mounting a wafer and a carrier plate; cleaning a support plate and the surface of the wafer with a plasma; warming up a plastic sealing powder; carrying out mold pressing and plastic sealing of the support plate provided with the wafer; and baking after plastic sealing. According to the method, the molding press plastic sealing process is used for replacing a glue injection plastic sealing process common in the field, and the problem that a side-mounted wafer is swashed down or a welding circuit is broken due to high injection molding pressure of 7 MPa of a mold flow is solved; the side-mounting of the wafer and the plastic sealing material is changed into the immersion method, so the high pressure process is omitted, and the sealing yield is improved; wide sides of the waferare extended or even excess the length of long sides, the practical application area of the wafer material is enlarged, and the cost of the wafer material is reduced; the side mounting of the wafer isnot limited by the mold flow pressure, a plurality of wafers are combined with the support plate in a building manner and stand tall and upright, and more selection schemes are provided for design ofvarious functional wafers.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a plastic packaging method for solving the mold flow problem of plastic packaging and widening the width of wafers. Background technique [0002] Wafer is the carrier used in the production of integrated circuits. It mostly refers to single crystal silicon wafers, as well as compound wafers such as gallium arsenide, silicon carbide, gallium nitride, and indium phosphide. In the semiconductor manufacturing process, wafers are usually designed and manufactured on a single side. However, as the demand for various functional integrations increases and becomes higher and higher, the requirements for transistor integration density become higher and higher, which becomes more and more challenging. [0003] Chip packaging, the current industry often adopts front-mount or flip-chip. Compared with the traditional method of front-mount or flip-chip, the main difference is that th...

AI Technical Summary

Problems solved by technology

The traditional plastic encapsulation process is only suitable for side-mounted wafers with long sides attached to the carrier board design, and the wafer width perpendicular to the carrier board is best within 500 microns

Images