Semiconductor diode lead-wire sealing system

A diode and semiconductor technology, which is applied in the field of semiconductor diode lead sealing system, can solve the problems of unsuitable sealing, low versatility, and low drying efficiency, so as to avoid uneven drying, avoid overvoltage deformation, reduce The effect of clamping deformation

Active Publication Date: 2018-08-28
苏州因知成新能源有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] This technical solution can seal the lead wire of the secondary tube, but only install a heating tube on one side when drying the glue after the sealing is completed, which makes the drying efficiency low, and this solution cannot be applied to different Thick and thin lead sealing glue makes it less versatile

Method used

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  • Semiconductor diode lead-wire sealing system
  • Semiconductor diode lead-wire sealing system
  • Semiconductor diode lead-wire sealing system

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Embodiment approach

[0024] As an embodiment of the present invention, the outer ring of the placement hole 7 is provided with a clamping device 8; the clamping device 8 includes a slider 81, a swivel 82 and an electric push rod 83; the inner wall of the placement hole 7 slides A group of sliders 81 are installed; the swivel 82 is screwed on the outer ring of a group of sliders 81 through a tapered thread; the swivel 82 is rotatably installed inside the placement block 6; One side of the ring 82; the electric push rod 83 is tangent to the swivel 82, and the electric push rod 83 stretches and is used to drive the swivel 82 to rotate, and the rotation of the swivel 82 is used to clamp or loosen the lead. When working, the electric push rod 83 telescopically pushes the swivel 82 to rotate, and the rotation of the swivel 82 makes the distance between the sliders 81 smaller or larger, correspondingly clamping lead wires of different thicknesses.

[0025] As an embodiment of the present invention, a set...

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PUM

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Abstract

The invention belongs to the technical field of semiconductor diode production, and particularly relates to a semiconductor diode lead-wire sealing system. The semiconductor diode lead-wire sealing system comprises a bottom plate, a vertical column, a top plate, a sealing groove, a drying module, a storing block and storing holes; a set of telescopic rods are arranged at the bottom of the top plate; the storing block is fixedly connected with the ends of the telescopic rods, and the set of storing holes are formed in the bottom of the storing block; the drying module comprises an arc-shaped sliding groove, an electric heating pipe, swinging gears and a swinging plate; the arc-shaped sliding groove is mounted in the middle of the vertical column; the electric heating pipe is slidably mounted in the arc-shaped sliding groove; a spring connected with the electric heating pipe is arranged at one end of the arc-shaped sliding groove; the swinging gears are rotatably mounted at the two endsof the electric heating pipe through torsion springs; the swinging plate rotatably mounted on the vertical column is arranged above the arc-shaped sliding groove; gear sockets meshed with the swinginggears are arranged at the ends of the swinging plate; and the swinging plate is controlled to rotate through a motor. The semiconductor diode lead-wire sealing system can conduct uniform drying on the sealed lead-wire; and by arranging a clamping device, the system can adapt to sealing of lead-wires with different thickness.

Description

technical field [0001] The invention belongs to the technical field of semiconductor diode production, in particular to a semiconductor diode lead wire sealing system. Background technique [0002] The leads of the diode need to be sealed with glue so that they can be prepared into a complete diode. In the existing sealing process, the lead wires are often repeatedly contacted between multiple sealing teeth on the sealing rack, so that the glue liquid above the sealing teeth realizes gluing treatment on the leads. However, in the above-mentioned sealing process, the lead wire will also rub against the sealing teeth while applying the glue, so that the lead wire may be bent; at the same time, it is difficult to ensure the uniformity of the glue distribution on the sealing teeth , It is also difficult to control the gluing uniformity of the lead. [0003] There are also some technical solutions for sealing diode leads in the prior art. For example, a Chinese patent with appl...

Claims

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Application Information

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IPC IPC(8): H01L21/67
CPCH01L21/67126
Inventor 兰凤方明进
Owner 苏州因知成新能源有限公司
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