Copper and copper alloy surface cleaning liquid and preparation method thereof

A surface cleaning and copper alloy technology, applied in the field of metal surface treatment, can solve the problems of spots on the surface of copper parts, insignificant brightening effect, unstable hydrogen peroxide, etc., to achieve excellent cleaning effect, smooth surface and good stability. Effect

Inactive Publication Date: 2018-08-17
深圳市祥盛兴科技有限公司
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  • Abstract
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  • Application Information

AI Technical Summary

Problems solved by technology

But the cleaning effect is relatively general, the brightening effect is not obvious, and spots may appear on the surface of copper parts
[0006] At the same time, due to factors such as the instability of hydrogen peroxide and the difficulty in controlling the ratio of hydrogen peroxide to sulfuric acid in the system, the obtained cleaning agent often has poor cleaning effect, easily produces stains on the surface of copper and copper alloys, and has poor brightening effect. Obvious disadvantages

Method used

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  • Copper and copper alloy surface cleaning liquid and preparation method thereof
  • Copper and copper alloy surface cleaning liquid and preparation method thereof
  • Copper and copper alloy surface cleaning liquid and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] Embodiment 1, the preparation of thickener

[0025] (1) Polymerization: Dissolve 2,4-toluene diisocyanate, N-methylmorpholine, ethylene glycol butyl ether and polyethylene glycol in acetone, heat and react to obtain a mixture solution. Among them, 2,4-toluene diisocyanate: N-methylmorpholine: ethylene glycol butyl ether: polyethylene glycol = 4:1:1:2, polymerization temperature 80°C;

[0026] (2) Capping: add acetone oxime to the mixture solution obtained in step S1, mix evenly, and heat to react to obtain the product. Among them, 2,4-toluene diisocyanate: acetone oxime = 2:1, and the end-capping temperature is 85°C.

[0027] Copper and copper alloy surface cleaning liquid component and its proportioning ratio (%) described in the embodiment of the present invention 2-4

[0028]

[0029]

[0030] Preparation process: Accurately weigh each substance in proportion, add a certain amount of hydrogen peroxide into the bright pickling tank, then slowly add bright add...

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Abstract

The invention belongs to the technical field of copper and copper alloy surface treatment, and particularly relates to copper and copper alloy surface cleaning liquid and a preparation method thereof.The cleaning liquid is mainly prepared from, by weight percent, 8% to 12% of 98% concentrated sulfuric acid, 70% to 75% of 30% hydrogen peroxide, 2% to 4% of an additive and 15% to 20% of a bright additive. The content of hydrogen peroxide in the cleaning liquid can reach up to 70% or above, the cleaning effect is good, and the copper and copper alloy surface brightness can be remarkably improved; and a copper material is smooth and flat in surface, ebulliency is not generated in the production process, high production safety is achieved, and the cleaning liquid is suitable for wide-range application and popularization.

Description

technical field [0001] The invention belongs to the technical field of metal surface treatment, and in particular relates to a copper and copper alloy surface cleaning solution and a preparation method thereof. Background technique [0002] Copper and copper alloys are the key basic functional materials for the development of modern science and technology, and are widely used in the processing and manufacturing of various high-precision devices. Due to the continuous improvement of material performance, precision and surface quality requirements, thinning, high precision, high performance, and high surface quality have become important development directions for modern high-precision copper and copper alloy strips, while high efficiency, high surface quality, and energy saving Environmentally friendly new surface cleaning technology is an important part of the development of high-precision copper and copper alloy production technology and equipment in the future. Sulfuric a...

Claims

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Application Information

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IPC IPC(8): C23G1/10
CPCC23G1/103
Inventor 徐艳春唐明松
Owner 深圳市祥盛兴科技有限公司
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