Copper alloy material and application thereof

Abstract

The invention discloses a copper alloy material. The copper alloy material comprises, by weight percent, 5.01 wt%-15.0 wt% of Zn, 0.1 wt%-3.0 wt% of Ni, 0.1 wt%-2.0 wt% of Sn, 0.01 wt%-0.5 wt% of Si,0.01 wt%-0.25 wt% of P, 0 wt%-0.2 wt% of Mg, 0 wt%-0.3 wt% of Fe, and the balance Cu and inevitable impurities. The copper alloy material is low in cost, and the problem about multi-waste utilizationcan be solved. The yield strength of the copper alloy material is larger than or equal to 600 MPa, the electric conductivity is larger than or equal to 30% IACS, the bending machining performance is excellent (the value R / t in the GW direction is smaller than or equal to 1, and the value R / t in the BW direction is smaller than or equal to 2), the stress relaxation resisting performance is excellent (heat preservation is conducted for 1,000 hours at the temperature of 150 DEG C, and residual stress is larger than or equal to 70%), the copper alloy material can be machined into bar wires, platestrips and other products, and the requirements of connectors, relays, switches, sockets, lead frames and other multiple industries for the copper alloy material are met.

Description

technical field [0001] The invention relates to the technical field of copper alloys, in particular to a copper alloy material with excellent yield strength, electrical conductivity and stress relaxation resistance and good bending processability, which can be applied to connectors, relays, switches, sockets, lead frames and other industries. Background technique [0002] In recent years, with the development of the electronics industry, terminal consumer electronic equipment is developing toward miniaturization, thinning and light weight, and the components such as terminals and connectors used use smaller electrical components with narrower electrode spacing. Due to such miniaturization, the materials used have also become thinner. However, from the perspective of connection reliability, the insertion force required for connection has not been reduced, which affects material strength, electrical conductivity, and stress relaxation resistance. And bending performance puts f...

AI Technical Summary

Problems solved by technology

[0003] Traditional brass, phosphor bronze, beryllium bronze, and copper-nickel-silicon-based copper alloys have been used in the electronics industry, but with the development of the electronics industry, these materials are difficult to meet the needs of cost and performance at the same time

Among them, the comprehensive performance of brass is insufficient, and it is difficult to meet the high demand for strength ≥ 550 MPa, electrical conductivity ≥ 25% IACS, stress relaxation resistance (1000 hours at 150 ℃, residual stress ≥ 60%) and bending processing performance. field

Phosphor bronze is an alloy whose strength is improved through work hardening. When it is kept at 150°C for 1000 hours, the residual stress is ≤50%, and its stress relaxation resistance is poor. The cost of materials is reduced, and the conductivity of phosphor bronze is low, only below 20% IACS, which cannot meet the requirements of high conductivity conditions, and has certain restrictions on the application of phosphor bronze

Beryllium bronze is prone to produce highly toxic substances in the production process and is expensive, so it is generally only used in certain military fields that require high elasticity and strength

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