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Photosensitive resin composition, cured film, laminate, member for touch panel, and method for manufacturing the cured film

A technology of photosensitive resin and composition, applied in the field of photosensitive resin composition, can solve the problems of insufficient chemical resistance, difficulty in applying On-sell, etc., and achieve the effects of good chemical resistance and excellent pattern processability

Active Publication Date: 2018-08-03
TORAY IND INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, inorganic materials need to be filmed at high temperature by CVD (Chemial Vapor Deposition, chemical vapor deposition) to form SiO 2 , SiNx, difficult to apply to On-sell class
In addition, conventional photosensitive transparent materials need to be cured at a temperature of 200° C. or higher, and when cured at a low temperature, chemical resistance is insufficient (for example, refer to Patent Document 1).

Method used

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  • Photosensitive resin composition, cured film, laminate, member for touch panel, and method for manufacturing the cured film
  • Photosensitive resin composition, cured film, laminate, member for touch panel, and method for manufacturing the cured film
  • Photosensitive resin composition, cured film, laminate, member for touch panel, and method for manufacturing the cured film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0122] Hereinafter, an Example is given and this invention is demonstrated more concretely. The present invention is not limited to these examples. Among the compounds used in Synthesis Examples and Examples, abbreviations are explained below.

[0123] PGMEA: Propylene Glycol Monomethyl Ether Acetate

[0124] PGME: Propylene Glycol Monomethyl Ether

[0125] MAM: Molybdenum / aluminum / molybdenum laminated film.

Synthetic example 1

[0126] Synthesis Example 1 (A-1) Synthesis of Cardo-based resin solution (a-1)

[0127] Into a 500 ml flask, 92.2 g of 9,9-bis(4-glycidyloxyphenyl) fluorene (manufactured by Osaka Gas Chemical Co., Ltd. "PG-100 (trade name)"), 14.4 g of acrylic acid, and tetrabutyl 0.32 g of ammonium acetate, 0.26 g of 2,6-di-t-butylcatechol, and 110 g of PGMEA were stirred at 120° C. for 9 hours. Next, 34.8 g of biphenyltetracarboxylic dianhydrides and 50 g of PGMEA were added, and further stirred at 120° C. for 5 hours. Thereafter, it was cooled to room temperature, and PGMEA was added so that the solid content concentration of the obtained (A-1) Cardo-based resin solution became 40 wt%, and (A-1) Cardo-based resin solution (a-1) was obtained as a PGMEA solution. The polystyrene-equivalent weight average molecular weight measured by the GPC method was 5,700.

Synthetic example 2

[0128] Synthesis Example 2 (A-2) Synthesis of Acrylic Resin Solution (a-2)

[0129] Into a 500 ml flask, 3 g of 2,2'-azobis(isobutyronitrile) and 50 g of PGMEA were charged. Then, 30 g of methacrylic acid, 22.48 g of styrene, and 25.13 g of cyclohexyl methacrylate were added. The mixed solution was stirred at room temperature for a while, and the inside of the flask was replaced with nitrogen, followed by heating and stirring at 70° C. for 5 hours. Next, 15 g of glycidyl methacrylate, 1 g of dimethylbenzylamine, 0.2 g of p-methoxyphenol, and 100 g of PGMEA were added to the obtained solution, followed by heating and stirring at 90° C. for 4 hours. Then, it cooled to room temperature, PGMEA was added so that the solid content concentration of the obtained (A-2) acrylic resin solution might become 40 wt%, and (A-2) acrylic resin solution (a-2) was obtained as PGMEA solution. The polystyrene equivalent weight average molecular weight measured by the GPC method was 13,500.

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Abstract

The purpose of the present invention is to provide a photosensitive resin composition that has excellent pattern processability and that is endowed with sufficient resistance to chemicals and adhesionto substrates even by low-temperature curing at 150 DEG C or below. The present invention is a photosensitive resin composition containing (A) unsaturated ethylene group- and carboxyl group-containing photoreactive resin, (B) an epoxy compound, (C) a polyfunctional epoxy compound, and (D) a photoinitiator.

Description

technical field [0001] The present invention relates to a photosensitive resin composition, a cured film, a member for a touch panel, and a method for producing a cured film. Background technique [0002] Most smartphones and tablet terminals today use capacitive touch panels. The sensor substrate of the capacitive touch panel has wiring obtained by patterning ITO (Indium Tin Oxide) and metal (silver, molybdenum, aluminum, etc.) on the glass. The intersection of wiring has the structure of a protective insulating film, ITO, and a metal protective film. Generally speaking, the protective film is made of high hardness inorganic SiO 2 , SiNx, photosensitive transparent material, etc., and the insulating film is often formed of photosensitive transparent material. [0003] The methods of touch panels are roughly divided into out-sell (out-sell) which forms the touch panel layer between the cover glass and the liquid crystal panel, and OGS (One Glass Solution) which forms the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/027C08F2/46C08G59/32G02F1/1333G03F7/004G03F7/038G03F7/085G06F3/041
CPCC08F2/46C08G59/32G02F1/1333G03F7/038G03F7/085C08K5/521G03F7/0388G03F7/032G06F2203/04103G06F2203/04112G06F2203/04111G06F3/0446G06F3/0443C08G59/36C08F2/50G03F7/004G03F7/027G06F3/041
Inventor 越野美加中道未来诹访充史
Owner TORAY IND INC
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