Bendable electronic device modules, articles and methods of making the same

Abstract

A foldable electronic device module includes a glass cover element having a thickness from about 25 [mu]m to about 200 [mu]m, an elastic modulus from about 20 GPa to about 140 GPa and a puncture resistance of at least 1.5 kgf. The module further includes a stack with a thickness between about 100 [mu]m and about 600 [mu]m; and a first adhesive joining the stack to the cover element with a shear modulus between about 1 MPa and about 1 GPa. The stack further includes a panel, an electronic device, and a stack element affixed to the panel with a stack adhesive. Further, the device module is characterized by a tangential stress at a primary surface of the cover element of no greater than about 1000 MPa in tension upon bending the module to a radius from about 20 mm to about 2 mm.

Description

[0001] Cross References to Related Applications [0002] This application claims priority under 35 U.S.C. §119 to U.S. Provisional Application Serial No. 62 / 290701, filed February 03, 2016, and U.S. Provisional Application Serial No. 62 / 240879, filed October 13, 2015, hereby incorporated by reference as It serves as a basis and is hereby incorporated by reference in its entirety, respectively. technical field [0003] The present disclosure generally relates to bendable electronics modules, articles, and methods of making them. More specifically, the present disclosure relates to bendable electronics modules having glass-containing covers for foldable display device applications. technical background [0004] Flexible versions of products and components that are often inherently rigid are being conceived for new applications. For example, flexible electronics can offer thin, lightweight, and flexible properties, which offer opportunities for new applications including curv...

AI Technical Summary

Problems solved by technology

Meanwhile, thicker glass substrates (>150 μm) can be fabricated with better puncture resistance, but these substrates lack suitable fatigue resistance and mechanical reliability after bending

[0007] Furthermore, due to the use of these flexible glass materials as cover elements in modules that also contain electronic components (e.g., thin-film transistors (“TFT”), touch screens, etc.), additional layers (e.g., polymer electronics panels) are The interaction of agents (e.g., epoxies, optically clear adhesives (“OCAs”)) between these various components and elements can lead to greater increasingly complex stress state

These complex stress states can cause the covering element to experience increased stress levels and / or stress concentration factors

As such, these covering elements can be prone to cohesive and / or delamination failure modes within the module

In addition, these complex interactions lead to increased bending forces required by the consumer to bend and fold the cover element

Images