Jack connection current collecting socket based on copper substrate

Abstract

The invention discloses a jack connection convergence socket based on a copper substrate. The socket comprises a base, first elastic contact bodies and a second elastic contact body. The base is provided with a plurality of upper holes side by side in the upper surface thereof, and the upper holes are provided with the first elastic contact bodies therein. A side hole is disposed in the lower halfof one side of the base, and the second elastic contact body is installed in the side hole. A threaded hole is arranged in the bottom surface of the base for positioning and fixing of the socket. Theupper holes are located in the upper half of the base. The side hole and the threaded hole are located in the lower half of the base. The upper holes, the side hole and the threaded hole are not in communication with one another. The socket of the invention adopts the whole copper material as the substrate to realize the large current convergence, and an adapted elastic spring retainer is installed in the hole after the precise drilling on one side so as to facilitate reliable connection with a wire crimping needle. The socket has the advantages of convenient use and maintenance. The "one-point multi-line restricted process" and hidden dangers brought by the flux residue are avoided. The production efficiency and processing reliability are increased.

Description

technical field [0001] The invention relates to the technical field of circuit design, in particular to a bus socket connected with a socket based on a copper substrate. The socket can be used to realize quick short-circuiting of multi-conductors, instead of using welding to realize short-circuiting of multi-conductors. The occurrence of virtual soldering defects has the characteristics of high wiring density and strong reflow capability. Background technique [0002] With the development of product miniaturization and multi-functionality, the space of electronic and electrical products is getting smaller and smaller. For products with high current control, limited to the connector function distribution and current carrying capacity requirements, the input terminal must gather multiple wires. Later transfer out or transfer, in order to cooperate with the realization of the function, there are often more than one group of such transfers. [0003] At present, in most product...

AI Technical Summary

Problems solved by technology

[0003] At present, in most products, crimping terminals are used to switch repeatedly to reduce the number of wires, but for more than 20 bus terminals, the space of crimping terminals alone cannot meet the product assembly requirements.

Therefore, in order to realize the product function, most manufacturers adopt the method of twisting multiple wires, tinning, and soldering for reflow short-circuiting. This method has very high requirements for operator skills, tools, and process control. Adequate, no stress disturbance during welding, etc. Otherwise, it is very easy to cause false welding, and at the same time, the flux residue in the stranding cannot be cleaned, and there is a hidden danger of joint corrosion during long-term use

Images