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Preparation method of heat conducting glue with low viscosity and high thermal conductivity

A high thermal conductivity, thermally conductive adhesive technology, applied in the direction of adhesives, non-polymer adhesive additives, adhesive additives, etc., can solve the problems of high thermally conductive adhesives, difficulty in laminating heavy work, etc., and achieve the effect of good repeatability

Inactive Publication Date: 2018-07-20
SUZHOU ENBRIGHTECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a method for preparing a thermally conductive adhesive with low viscosity and high thermal conductivity, so as to solve the problem in the prior art that the thermally conductive adhesive has high viscosity and makes it difficult to attach and rework.

Method used

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  • Preparation method of heat conducting glue with low viscosity and high thermal conductivity
  • Preparation method of heat conducting glue with low viscosity and high thermal conductivity
  • Preparation method of heat conducting glue with low viscosity and high thermal conductivity

Examples

Experimental program
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Effect test

Embodiment 1

[0022] A method for preparing a thermally conductive adhesive with low viscosity and high thermal conductivity, the mass percentage of each component is:

[0023]

[0024] (1) According to the above formula, weigh the dispersant and silane coupling agent and dilute with dimethyl carbonate, add thermal conductive fillers BN and Al 2 0 3 , use a homogenizer at a speed of 1500rpm, mix for 2min;

[0025] (2) Add pressure-sensitive adhesive, and use a homogenizer to mix for 2 minutes at a speed of 1500 rpm;

[0026] (3) Add leveling agent, defoamer and wetting agent, and mix for 1 min at a speed of 1500 rpm using a homogenizer;

[0027] (4) Add epoxy curing agent, and use a homogenizer to mix for 1 min at a speed of 1500 rpm;

[0028] (5) Coating the mixture on both sides of the substrate, curing and drying at 80-90° C. for 10-20 minutes, to obtain a thermally conductive adhesive with low viscosity and high thermal conductivity.

Embodiment 2

[0030] A method for preparing a thermally conductive adhesive with low viscosity and high thermal conductivity, the mass percentage of each component is:

[0031]

[0032] (1) According to the above formula, weigh the dispersant, titanate and silane coupling agent and dilute with ethyl acetate, add the thermal conductive filler Al(OH) 3 and Al 2 0 3 , use a homogenizer at a speed of 1500rpm, mix for 2min;

[0033] (2) Add pressure-sensitive adhesive, and use a homogenizer to mix for 2 minutes at a speed of 1500 rpm;

[0034] (3) Add leveling agent, defoamer and wetting agent, and mix for 1 min at a speed of 1500 rpm using a homogenizer;

[0035] (4) Add epoxy curing agent, and use a homogenizer to mix for 1 min at a speed of 1500 rpm;

[0036] (5) Coating the mixture on both sides of the substrate, curing and drying at 80-90° C. for 10-20 minutes, to obtain a thermally conductive adhesive with low viscosity and high thermal conductivity.

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Abstract

The invention relates to a preparation method of a heat conducting glue with low viscosity and high thermal conductivity. The preparation method comprises following steps: weighing a dispersant and acoupling agent, adding a solvent to dilute the mixture, adding a heat conducting filling material, mixing the mixture for 2 minutes by a homogenizer; adding a pressure sensitive glue, mixing the mixture for 2 minutes by the homogenizer; adding an auxiliary agent, mixing the mixture for 1 minute by the homogenizer; adding a curing agent, mixing the mixture for 1 minute by the homogenizer; paintingthe mixture on two sides of a base material, and carrying out curing and drying to obtain the heat conducting glue. The heat conducting glue is made of different heat conducting filling materials, isprepared by a special technology, has a multilayer structure and low viscosity at a room temperature, can be repeatedly laminated, does not generate any residue, can be repeatedly used, and has excellent viscosity and heat conductivity at a high temperature, and the operability and high heat conductivity are perfectly combined.

Description

technical field [0001] The invention relates to the field of heat-conducting adhesive preparation, in particular to a method for preparing a heat-conducting adhesive with low viscosity and high thermal conductivity. Background technique [0002] With the improvement of living standards, the demand for large-size and thinner household TVs is also increasing rapidly. For large-size and thinner TVs, heat dissipation is a crucial issue. Emission will lead to an increase in the operating temperature of electronic components, which will affect the service life and reliability of the product. In order to solve the problem of heat accumulation inside the body, thermally conductive interface materials are often used as the carrier for heat export. As a commonly used thermal interface material, thermally conductive adhesive can closely and firmly fit the heat source device because of its softness and strong viscosity, and quickly conduct heat away. At the same time, due to its easy ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/38C09J11/04
CPCC08K2003/2227C08K2003/385C09J11/04C09J2301/124C09J2301/302C09J2301/408
Inventor 许臻
Owner SUZHOU ENBRIGHTECH
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