Special-shaped metal particle electric-conduction adhesive film and production method thereof

Abstract

The invention discloses a special-shaped metal particle electric-conduction adhesive film, which comprises an electric-conduction adhesive layer and a release film layer or a carrier film layer adhered to the lower surface of the electric-conduction adhesive layer, wherein the thickness of the electric-conduction adhesive layer is 15-60 [mu]m, the electric-conduction adhesive layer comprises metalelectric-conduction particles and an adhesive resin according to a weight ratio of 1:1-5:1, and the metal electric-conduction particles comprise at least two selected from dendritic metal powder, needle-like metal powder, flaky metal powder and spherical metal powder, and have a particle size of 2-22 [mu]m. According to the present invention, the special-shaped metal particle electric-conductionadhesive film has characteristics of excellent fluidity during pressing, good electrical property, high shielding performance, good bonding strength, less transmission loss, high transmission quality,good reliability and the like, has good grounding effect compared to the general electric-conduction films, and further has wide market application prospects.

Description

technical field [0001] The invention belongs to the technical field of conductive adhesives for printed circuits, in particular to a conductive adhesive film with high conductivity and good shielding properties. Background technique [0002] With the development of the electronic industry, the development direction of electronic and communication products tends to be multi-functional and complex. In appearance, electronic components are developing towards miniaturization and miniaturization, and printed circuit boards are developing towards high density and high integration; functionally, the transmission signal frequency is developing towards high broadband. [0003] The grounding reliability of electronic components has an important impact on the safety of electronic products. Although the conductive adhesive products commonly used in the market can be connected to the grounding holes reserved in general printed circuit boards, there will be problems caused by the conducti...

AI Technical Summary

Problems solved by technology

[0003] The grounding reliability of electronic components has an important impact on the safety of electronic products. Although the conductive adhesive products commonly used in the market can be connected to the grounding holes reserved in general printed circuit boards, there will be problems caused by the conductive adhesive. Insufficient hole filling leads to gaps in the connection part of electronic components during reflow soldering, which makes the shielding effect of the printed circuit board poor, which brings safety hazards to the use of electronic products; it will also affect other electronic components due to the conductive adhesive filling the ground hole too full. The design and installation of components, thus affecting the miniaturization and miniaturization of electronic components

In addition, the increase in the bandwidth of transmission signals will lead to more and more serious electromagnetic interference problems on printed circuit boards. However, the existing conductive adhesives generally have low conductivity and low shielding performance, and it is difficult to meet the market's demand for broadband transmission signals.

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