Heat sink material used for light emitting diode for high-luminance semiconductor illumination
A technology of light-emitting diodes and heat sink materials, which is applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of decreased brightness, insufficient length of diode pins, inconvenient installation, etc., and achieve cost saving and good installation stability , The effect of convenient maintenance and replacement
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Embodiment 1
[0040] A heat sink material for high-brightness semiconductor lighting light-emitting diodes, comprising the following components in parts by mass: 30 parts of graphene, 4 parts of carbon nanotubes, 3 parts of silicon carbide, 2 parts of silver conductive glue, and 0.5 parts of vanadium oxide 3 parts of calcium carbonate, 4 parts of sodium hydroxymethyl cellulose, 10 parts of alumina particles, 10 parts of magnesium oxide, 5 parts of antimony trioxide, 2 parts of sodium metasilicate, 2 parts of bentonite, 2 parts of calcium phosphate, 4 parts of zirconia sol, 3 parts of light calcium, 9 parts of cellulose, 3 parts of dimethyl itaconate, 5 parts of binder, 1 part of coupling agent, 1 part of compatibilizer, 0.8 parts of antioxidant, 0.5 part of stabilizer.
[0041] Among them, the bentonite is modified before use. During the treatment, 10 parts by mass of bentonite and 2 parts by mass of glycerin are mixed and stirred, then 0.5 parts by mass of citric acid is added, and stirred...
Embodiment 2
[0049] A heat sink material for high-brightness semiconductor lighting light-emitting diodes, comprising the following components in parts by mass: 35 parts of graphene, 6 parts of carbon nanotubes, 5 parts of silicon carbide, 5 parts of silver conductive glue, and 1.5 parts of vanadium oxide 4.5 parts of calcium carbonate, 5 parts of sodium hydroxymethyl cellulose, 12 parts of alumina particles, 15 parts of magnesium oxide, 8 parts of antimony trioxide, 3 parts of sodium metasilicate, 2 parts of bentonite, 3 parts of calcium phosphate, 4 parts of zirconia sol, 4 parts of light calcium, 11 parts of cellulose, 4 parts of dimethyl itaconate, 8 parts of binder, 2 parts of coupling agent, 1 part of compatibilizer, 1.2 parts of antioxidant, 1 part of stabilizer.
[0050] Among them, the bentonite is modified before use. During the treatment, 10 parts by mass of bentonite and 2 parts by mass of glycerin are mixed and stirred, then 0.5 parts by mass of citric acid is added, and stirr...
Embodiment 3
[0058] A heat sink material for high-brightness semiconductor lighting light-emitting diodes, comprising the following components in parts by mass: 40 parts of graphene, 8 parts of carbon nanotubes, 6 parts of silicon carbide, 8 parts of silver conductive glue, and 3 parts of vanadium oxide 5 parts of calcium carbonate, 6 parts of sodium hydroxymethyl cellulose, 15 parts of alumina particles, 20 parts of magnesium oxide, 10 parts of antimony trioxide, 4 parts of sodium metasilicate, 4 parts of bentonite, 3 parts of calcium phosphate, 6 parts of zirconia sol, 5 parts of light calcium, 13 parts of cellulose, 5 parts of dimethyl itaconate, 12 parts of binder, 2 parts of coupling agent, 2 parts of compatibilizer, 1.4 parts of antioxidant, 2 parts of stabilizer.
[0059] Among them, the bentonite is modified before use. During the treatment, 10 parts by mass of bentonite and 2 parts by mass of glycerin are mixed and stirred, then 0.5 parts by mass of citric acid is added, and stirr...
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