Organic anti-oxidation method for bonding wires

Abstract

The invention discloses an organic anti-oxidation method for bonding wires. According to the method, organic anti-oxidation process treatment is added to a later period of a copper boding wire drawingprocess to solve the problem of high proneness to oxidation of micro-scale copper boding wires. Compared with the prior art, the organic anti-oxidation method has the advantages that anti-oxidation performance of the micro-scale copper boding wires can be improved greatly, so that oxidation points are not generated on the surfaces of the micro-scale copper boding wires, and high electric performance and packaging stability can be realized during microelectronic package and interconnection; the micro-scale copper boding wires obtained according to the method have excellent anti-oxidation performance, and production cost can be reduced to a great extent; the method has great promotion significance in anti-oxidation of the copper bonding wires and even in copper wire bonding and packaging markets.

Description

technical field [0001] The invention relates to the field of manufacturing bonding wires for microelectronic packaging and interconnection, in particular to an anti-oxidation method for treating micron copper bonding wires with organic matter during wire drawing. Background technique [0002] Bonding wire is one of the four key basic materials in the field of microelectronic packaging and interconnection. In the manufacturing process of bonding wire, it is necessary to gradually draw thick wires with a diameter of several thousand microns to meet the requirements of use. Micron filaments, and this process is realized by the wire drawing module installed on the wire drawing machine. However, micron-sized copper bonding wires are more likely to be oxidized due to their large specific surface area, resulting in oxidation spots on the surface of the bonding wires. [0003] Oxidized bonding wires will greatly affect the conductivity and bonding of the package during EFO treatmen...

AI Technical Summary

Problems solved by technology

However, micron-sized copper bonding wires are more likely to be oxidized due to their large specific surface area, resulting in oxidation spots on the surface of the bonding wires

[0003] Oxidized bonding wires will greatly affect the conductivity and bonding of the package during EFO treatment, which is not allowed in the field of microelectronic packaging. The current general method is to coat a layer of precious metal on the metal surface For example, palladium plays a certain role in anti-oxidation, but the production cost is greatly increased, and the hardness of the material is significantly increased, which is not conducive to bonding

[0004] At present, due to the further increase in the integration of the entire microelectronics industry, and the gap left for package bonding in wire bonding is becoming smaller and smaller, the requirements for bonding wires in the entire industry are also getting higher and higher. For the current For pure metal bonding wire, as the diameter of bonding wire decreases, only pure copper bonding wire can meet the requirements of strength, electron mobility, conductivity and heat dissipation; for the oxidation resistance of copper bonding wire, The method currently used is mainly to form an inorganic protection layer of metal protective layer on the copper surface. However, this method can prevent the copper bonding wire from being oxidized to a certain extent, but it increases the production cost of the copper bonding wire; Secondly, the thickness and density of the metal protective layer on the surface of the copper metal are also difficult to accurately control.

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