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Method for decreasing MOD type silver ink film defects by adjusting ink droplet spacing

A thin film defect and spacing technology, applied to the conductive layer, electrical components, circuits, etc. on the insulating carrier, can solve the problems of complex theory and principle, increase the time and cost required for the process, and cumbersome implementation process, and achieve a uniform and flat surface , the effect of reducing time and material costs

Inactive Publication Date: 2018-06-29
SOUTH CHINA UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the implementation process of these methods is relatively cumbersome, and the theory and principle are very complicated, which increases the time and cost required for the process.

Method used

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  • Method for decreasing MOD type silver ink film defects by adjusting ink droplet spacing
  • Method for decreasing MOD type silver ink film defects by adjusting ink droplet spacing
  • Method for decreasing MOD type silver ink film defects by adjusting ink droplet spacing

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] (1) Wash the substrate of a glass sheet with a length and width of 1cm×1cm and a thickness of about 0.7mm with isopropanol, tetrahydrofuran, alkaline cleaning solution, deionized water for the first time, deionized water for the second time, and isopropanol. Vibrate each step with an ultrasonic cleaner for 5-10 minutes. Then put the cleaned substrate into an oven and dry it at 80-85°C.

[0033] (2) adopt TEC-IJ-010MOD solution type silver ink with printer (Dimatix DMP-2800 printer) (purchase from Korea InkTec company; Solid content is 15%, and viscosity is 9~15cps, and surface tension is 30~32dynes / cm, The solvent used is ethanol, the recommended sintering temperature is 130°C-150°C, and the reference resistivity is 4.2μΩ·cm), and the preset graphics are printed on the substrate after cleaning and drying in step (1), where the printing parameters are set as follows: The distance between the nozzle and the substrate is 1000 μm, the distance between ink droplets is 15 μm...

Embodiment 2

[0037] (1) Wash the substrate of a glass sheet with a length and width of 1cm×1cm and a thickness of about 0.7mm with isopropanol, tetrahydrofuran, alkaline cleaning solution, deionized water for the first time, deionized water for the second time, and isopropanol. Vibrate each step with an ultrasonic cleaner for 5-10 minutes. Then put the cleaned substrate into an oven and dry it at 80-85°C.

[0038] (2) adopt TEC-IJ-010MOD solution type silver ink with printer (Dimatix DMP-2800 printer) (purchase from Korea InkTec company; Solid content is 15%, and viscosity is 9~15cps, and surface tension is 30~32dynes / cm, The solvent used is ethanol, the recommended sintering temperature is 130°C-150°C, and the reference resistivity is 4.2μΩ·cm), and the preset graphics are printed on the substrate after cleaning and drying in step (1), where the printing parameters are set as follows: The distance between the nozzle and the substrate is 1000 μm, the distance between ink droplets is 20 μm...

Embodiment 3

[0042] (1) Wash the substrate of a glass sheet with a length and width of 1cm×1cm and a thickness of about 0.7mm with isopropanol, tetrahydrofuran, alkaline cleaning solution, deionized water for the first time, deionized water for the second time, and isopropanol. Vibrate each step with an ultrasonic cleaner for 5-10 minutes. Then put the cleaned substrate into an oven and dry it at 80-85°C.

[0043] (2) adopt TEC-IJ-010MOD solution type silver ink with printer (Dimatix DMP-2800 printer) (purchase from Korea InkTec company; Solid content is 15%, and viscosity is 9~15cps, and surface tension is 30~32dynes / cm, The solvent used is ethanol, the recommended sintering temperature is 130°C-150°C, and the reference resistivity is 4.2μΩ·cm), and the preset graphics are printed on the substrate after cleaning and drying in step (1), where the printing parameters are set as follows: The distance between the nozzle and the substrate is 1000 μm, the distance between ink droplets is 25 μm...

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Abstract

The invention belongs to the technical field of photovoltaic materials, and discloses a method for decreasing MOD type silver ink film defects by adjusting ink droplet spacing. The method comprises the following steps: ultrasonically washing a base, and drying; with an ink jetting printing method, selecting the ink droplet spacing ranging from 35-45 microns, and printing a preset pattern on the base by the MOD type silver ink to form a liquid silver film; and curing on a heating platform to obtain the silver conductive film. According to the method, the surface filming defect of the MOD silverink after thermal curing is reduced by adjusting the ink droplet spacing, and thus the silver film with an uniform and flat surface can be obtained; and the method is applicable to manufacturing of metal conductive electrodes.

Description

technical field [0001] The invention belongs to the technical field of photoelectric materials, and in particular relates to a method for reducing MOD-type silver ink film defects by adjusting the distance between ink droplets. Background technique [0002] Metal-Organic decomposition silver ink (MODsilver ink for short) is a kind of silver ink widely used in the preparation of conductive films, which mainly produces silver nanoparticles through the decomposition reaction of silver compounds, thereby forming conductive silver film. [0003] Since the MOD type silver ink is mainly composed of silver compounds and organic solvents, the decomposition reaction takes a long time and a high temperature to complete completely. However, during thermal curing, a large number of bubbles generated by the violent volatilization of organic solvents are discharged from the bottom to the surface, which can easily lead to local unevenness or thinning of the liquid film within a certain per...

Claims

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Application Information

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IPC IPC(8): H01B13/00H01B5/14
CPCH01B13/00H01B5/14
Inventor 宁洪龙周艺聪姚日晖陶瑞强陈建秋杨财桂蔡炜朱镇南魏靖林彭俊彪
Owner SOUTH CHINA UNIV OF TECH
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