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Suspension structural microwave filter and manufacturing method thereof

A microwave filter and suspension structure technology, applied in waveguide devices, microstructure technology, microstructure devices, etc., can solve the problems of large filter volume, high dielectric loss, and filter performance affected by the length of the bonding wire, etc., to achieve volume Small, low loss effect

Inactive Publication Date: 2018-06-26
INST OF MICROELECTRONICS CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] The suspended structure microwave filter and its preparation provided by the present invention can address the deficiencies of the prior art, and solve the problems of the prior art that the filter is large in volume, the filtering performance is affected by the length of the bonding wire, and the dielectric loss is high

Method used

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  • Suspension structural microwave filter and manufacturing method thereof
  • Suspension structural microwave filter and manufacturing method thereof
  • Suspension structural microwave filter and manufacturing method thereof

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Embodiment Construction

[0034] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is only some embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0035] In the first aspect, an embodiment of the present invention provides a silicon-based double-layer microwave filter with through holes and a suspended structure, the basic structure of which is an interdigitated suspended stripline filter structure. The filter is formed by stacking two layers of dielectric materials up and down, and the...

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Abstract

The invention provides a suspension structural microwave filter. The suspension structural microwave filter comprises an upper silicon wafer and a lower silicon wafer; a concave cavity is etched on the lower surface of the upper silicon wafer, and used for forming an encapsulation cap structure; a dielectric film is deposited on the upper surface of the lower silicon wafer; an interdigital electrode pattern is formed on the dielectric film, wherein the silicon substrate below the dielectric film on the upper surface of the lower silicon wafer is eliminated, so that the suspension state of thedielectric film is formed; and the upper silicon wafer and the lower silicon wafer are stacked and assembled through an alignment bonding process. The suspension structural microwave filter provided by the invention has the advantages of being small in volume, low in loss and high in performance.

Description

technical field [0001] The invention relates to the technical field of wireless communication hardware equipment, in particular to a suspended structure microwave filter and a preparation method thereof. Background technique [0002] A filter is a filter circuit composed of capacitors, inductors and resistors. The filter can effectively filter out the frequency points of a specific frequency or frequencies other than this frequency point, obtain a signal of a specific frequency or eliminate a signal of a specific frequency. Therefore, filters are widely used in electronic systems such as satellite communications and aerospace. With the development of information technology and semiconductor devices, electronic systems are gradually developing in the direction of high density, high performance, and miniaturization. The miniaturization of filters has gradually become the biggest bottleneck in the miniaturization of electronic systems in modern technology. [0003] The tradit...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01P1/207H01P11/00B81B7/02B81C1/00
CPCH01P1/207B81B7/02B81C1/00531B81C1/00539H01P11/007
Inventor 欧毅李志刚蒋文静刘战峰欧文曹立强
Owner INST OF MICROELECTRONICS CHINESE ACAD OF SCI
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