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Preparation method of photosensitive resin with flame retardancy and application of photosensitive resin on circuit board

A photosensitive resin, flame retardant technology, applied in the application field of photosensitive ink on circuit boards, can solve the problems of non-flame retardant, poor flexibility, poor chemical resistance of covering materials, etc., to achieve good chemical resistance, Good bending resistance

Active Publication Date: 2018-06-22
盐城艾肯科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Now the high-precision liquid photosensitive solder resist ink has been successfully developed on the market, and its flexibility and chemical resistance are also very good, but the defect is that it is not flame retardant. If a large amount of flame retardant is added to meet the flame retardant requirements, it will lead to flexibility Sexual deterioration
[0004] Traditional photosensitive covering materials are based on modified bisphenol A type epoxy resin or modified bisphenol F type epoxy resin as the starting raw material and connected with unsaturated bonds and carboxyl groups as the photosensitive resin. The heat resistance of the synthesized photosensitive resin The chemical resistance and bending resistance are not bad, but the disadvantage is that it is not flame retardant. To meet the flame retardant requirements, a flame retardant must be added to the photosensitive covering material, which will lead to poor chemical resistance and flexibility of the covering material. Difference
Chinese patent documents, such as CN201180013287.6 "A Photosensitive Resin Composition", CN200810108680.3 "Photosensitive Resin Composition and Flexible Circuit Board Using It", all of the disclosed technical solutions can be used on FPC It has flame retardant properties, but the flame retardants mentioned in the literature are all flame retardants added to meet the flame retardant requirements

Method used

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  • Preparation method of photosensitive resin with flame retardancy and application of photosensitive resin on circuit board
  • Preparation method of photosensitive resin with flame retardancy and application of photosensitive resin on circuit board
  • Preparation method of photosensitive resin with flame retardancy and application of photosensitive resin on circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] Pour 40 grams of solvent γ-butyrolactone into a three-necked flask, add 26 grams of IPDI and 15.2 grams of tetrahydrophthalic anhydride, slowly heat to 150°C, react for 2 hours, then add 80 grams of novolac epoxy resin, and react at 150°C After 4 hours, imide-modified epoxy resin 1 was obtained.

[0043] Add 20 grams of solvent γ-butyrolactone, 25 grams of unsaturated monocarboxylic acid acrylic acid, and 1 gram of catalyst triphenylphosphine to 160 grams of the above-mentioned imide-modified epoxy resin 1, and heat to 100-120 ° C for 8 hours Afterwards, 25 grams of tetrahydrophthalic anhydride, an acid anhydride-containing substance, was added, and heated to 100-120° C. for 5 hours to obtain photosensitive resin 1 with flame-retardant properties.

Embodiment 2

[0045] Pour 40 grams of diethylene glycol ethyl ether acetate into a three-necked flask, add 96 grams of TDI, 20 grams of alkenyl succinic anhydride, slowly heat to 200 ° C, react for 6 hours, and then add 4,5-epoxycyclohexane 70 g of diglycidyl alkane-1,2-dicarboxylate was reacted at 200°C for 8 hours to obtain imide-modified epoxy resin 2.

[0046] Add 40 grams of solvent diethylene glycol ethyl ether acetate, 40 grams of crotonic acid, and 10 grams of triethylamine to 200 grams of the above-mentioned imide-modified epoxy resin 2, heat to 120-140 ° C for 2 hours and then add olefin 40 grams of succinic anhydride was heated to 120-140° C. for 3 hours to obtain photosensitive resin 2 with flame retardancy.

Embodiment 3

[0048] Pour 50 grams of dimethylpropionamide into a three-necked flask, add 50 grams of MDI, 30 grams of glutaric anhydride, slowly heat to 250 ° C, react for 2 hours, then add N, N-glycidyl-2,4, 80 g of 6-tribromoaniline was reacted at 200°C for 3 hours to obtain imide-modified epoxy resin 3.

[0049] Add 150 grams of solvent dimethylpropionamide, 120 grams of 5-hexenoic acid, and 90 grams of N,N-dimethylethanolamine to 210 grams of the above-mentioned imide-modified epoxy resin 2, and heat to 70-90 ° C for reaction After 10 hours, 90 grams of glutaric anhydride was added, heated to 70-90° C. and reacted for 9 hours to obtain photosensitive resin 3 with flame retardancy.

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Abstract

The invention relates to a photosensitive covering material used on a flexible circuit board. In order to overcome difficulties in the prior art, the invention provides a preparation method of the photosensitive resin with flame retardancy, and the preparation method comprises the following steps: dissolving imide modified epoxy resin in a solvent, carrying out a reaction with unsaturated monocarboxylic acid under the action of a catalyst at 70-140 DEG C for 1-10 hours, and then carrying out a reaction with a anhydride-containing material at 70-140 DEG C for 1-10 hours to prepare the photosensitive resin with flame retardancy, good bending resistance and good chemical resistance. Meanwhile, the invention also provides an application of photosensitive ink prepared by the photosensitive resin with flame retardancy on a circuit board, the heat resistance and chemical resistance of the ink are ensured, and the bending resistance after the ink is cured is also ensured.

Description

technical field [0001] The invention relates to a photosensitive covering material used on a flexible circuit board, in particular to a photosensitive resin with flame-retardant properties and the application of the prepared photosensitive ink on the circuit board. Background technique [0002] Under the trend of miniaturization of consumer electronic products, flexible circuit boards (hereinafter referred to as FPC) are also developing in the direction of high density (HDI) with a line spacing of less than 0.2mm and an aperture of less than 0.25mm, and will also develop in the direction of ultra-high density in the future. The line distance is less than 0.1mm, and the aperture is less than 0.075mm. At present, the hole diameter of 0.05mm can be achieved in the market, and the hole diameter between 0.025 and 0.05mm has become the focus of attention. At the same time, the flex-rigid combination board will also be the development trend in the future. space. Flex-rigid bonded...

Claims

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Application Information

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IPC IPC(8): C08G59/17C08G59/16C08G59/14C09D11/102
CPCC08G59/145C08G59/1455C08G59/1466C08G59/1472C08G59/1477C09D11/102
Inventor 林华君陶青松林倪颖牟敏仁
Owner 盐城艾肯科技有限公司
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