Rapid mapping method for CVD diamond coating wire drawing die hole pattern

A technology of diamond coating and wire drawing die, which is applied in the direction of measuring device, mechanical measuring device, mechanical counter/curvature measurement, etc., can solve the problems of expensive surveying and mapping equipment and low surveying and mapping accuracy, and achieve low cost, high surveying and mapping accuracy, surveying and mapping high efficiency effect

Inactive Publication Date: 2018-06-12
四川纳涂科技有限公司
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  • Claims
  • Application Information

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Problems solved by technology

[0004] The technical problem to be solved by the present invention is to provide a rapid surveying and mapping method for the pass pattern of the CVD diamond coating wire d...

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  • Rapid mapping method for CVD diamond coating wire drawing die hole pattern
  • Rapid mapping method for CVD diamond coating wire drawing die hole pattern
  • Rapid mapping method for CVD diamond coating wire drawing die hole pattern

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Embodiment Construction

[0024] The present invention will be further described below with reference to the accompanying drawings and embodiments, and the mode of the present invention includes but not limited to the following embodiments.

[0025] Such as Figure 1-3 As shown, the rapid surveying and mapping method of a CVD diamond-coated wire drawing die provided by the present invention has scientific and reasonable design, simple operation, high surveying and mapping efficiency, high surveying and mapping accuracy, and the equipment and materials used are simple and low in cost. The present invention comprises the following steps:

[0026] (1) Place the drawing die in an ultrasonic cleaning machine and take it out after cleaning for 30 seconds;

[0027] (2) Place the wire drawing die cleaned in step (1) in a constant temperature drying box and bake for 30 minutes, the baking temperature of the constant temperature drying box is 35°C;

[0028] (3) Take out the wire drawing mold baked in step (2) ...

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Abstract

The invention discloses a rapid mapping method for a CVD diamond coating wire drawing die hole pattern. The problems of expensive mapping equipment and low mapping accuracy of a mapped hole pattern with small aperture in the prior art are solved. The method provided by the invention specifically comprises the steps that a wire drawing die is put in an ultrasonic cleaning machine, is cleaned for 30seconds, is taken out, is baked for 30 minutes in a constant temperature drying box, and is put on a constant temperature operation panel; a hot melt gun with built-in hot melt glue is used to injectthe hot melt glue into a wire drawing die hole, and injection is stopped at 2/3 of a lubrication zone; after the hot melt glue in the wire drawing die hole is solidified to form a hole die, a suitable amount of hot melt glue is injected to form a chuck; the hole die is extracted by tweezers or needle-nose pliers; and the dimension of each zone of the hole die is measured by a micrometer, and thehole pattern map of the wire drawing die hole is drawn. The rapid mapping method provided by the invention has the advantages of scientific and reasonable design, simple operation, high mapping efficiency, high mapping accuracy, simple equipment and materials and low cost.

Description

technical field [0001] The invention relates to a rapid surveying and mapping method for the hole pattern of a CVD diamond coating wire drawing die. Background technique [0002] At present, wire drawing die manufacturers need to conduct spot checks on the pass type and size of the wire drawing die during the production of the wire drawing die to determine whether there are technical problems in the processing, and a 3D surveying instrument is used for surveying the pass type and size. There are two main types of 3D instruments known to the public to measure the hole shape and size of the wire drawing die, the probe-type surveying instrument and the optical surveying instrument. The probe-type surveying instrument inserts the probe into the drawing die and emits Analyze the difference between the drawing die and the received signal, draw the hole pattern of the wire drawing die and calculate the size of each area; the optical mapping instrument is composed of a light source,...

Claims

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Application Information

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IPC IPC(8): G01B5/00G01B5/20
CPCG01B5/00G01B5/20
Inventor 黄飞
Owner 四川纳涂科技有限公司
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