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Integrated piezoelectric micromechanical ultrasonic transducer pixel and array

An ultrasonic transducer and micro-machine technology, applied in piezoelectric devices/electrostrictive devices, piezoelectric/electrostrictive/magnetostrictive devices, electro-solid devices, etc., and can solve problems such as limiting the size of arrays

Inactive Publication Date: 2018-06-08
QUALCOMM INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Conventional ultrasound imaging arrays may require an excessive number of hardwired interconnections to external interface circuits, which may limit the size of the array

Method used

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  • Integrated piezoelectric micromechanical ultrasonic transducer pixel and array
  • Integrated piezoelectric micromechanical ultrasonic transducer pixel and array
  • Integrated piezoelectric micromechanical ultrasonic transducer pixel and array

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Embodiment Construction

[0045] The systems, methods, and devices of the present disclosure each have several innovative aspects, no single one of which is solely responsible for the desirable attributes disclosed herein. One novel aspect of the subject matter described in this disclosure can be implemented in a piezoelectric micromachined ultrasound transducer (PMUT) configured as a multilayer stack comprising a multilayer diaphragm structure comprising Stack of piezoelectric layers and two or more electrodes. In an embodiment having three electrodes, the three electrodes may include separate electrodes for transmitting signals to and receiving signals from each of the associated transceiver circuits, as well as a common reference or ground electrode. The arrangement allows the timing of transmission and reception to be independent of each other, thereby enabling simultaneous transmission and reception of, for example, ultrasonic waves. In some implementations, the transmit and receive electrodes ca...

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Abstract

An ultrasonic sensor pixel includes a substrate, a piezoelectric micromechanical ultrasonic transducer (PMUT) and a sensor pixel circuit. The PMUT includes a piezoelectric layer stack including a piezoelectric layer disposed over a cavity, the cavity being disposed between the piezoelectric layer stack and the substrate, a reference electrode disposed between the piezoelectric layer and the cavity, and one or both of a receive electrode and a transmit electrode disposed on or proximate to a first surface of the piezoelectric layer, the first surface being opposite from the cavity. The sensor pixel circuit is electrically coupled with one or more of the reference electrode, the receive electrode and the transmit electrode and the PMUT and the sensor pixel circuit are integrated with the sensor pixel circuit on the substrate.

Description

[0001] Cross References to Related Applications [0002] This disclosure claims U.S. Provisional Patent Application No. 62 / 241,651, filed October 14, 2015, entitled "INTEGRATED PIEZOELECTRIC MICROMECHANICAL ULTRASONIC TRANSDUCER PIXELAND READOUT," and Priority to U.S. Patent Application No. 15 / 292,057, entitled "INTEGRATED PIEZOELECTRIC MICROMECHANICAL ULTRASONIC TRANSDUCER PIXEL AND ARRAY," filed October 12, 2016, which states The entire disclosure of the patent application is incorporated herein by reference. technical field [0003] The present disclosure relates to piezoelectric ultrasound transducers and to electronic sensor arrays or interactive displays of piezoelectric transducers for biometric sensing, imaging, and touch or gesture recognition. Background technique [0004] Thin-film piezoacoustic transducers are attractive candidates for numerous applications including biometric sensors such as fingerprint sensors, gesture detection devices, microphones and speak...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06K9/00G10K11/34B06B1/06B06B1/02H10N30/20H10N39/00H10N30/071H10N30/30H10N30/50
CPCB06B1/0207B06B1/0607H10N39/00H10N30/071G01S7/52028G06F3/0436H01L27/1214G06V40/1306H10N30/50H10N30/20H10N30/302
Inventor 赫瑞什科士·维加伊库马尔·班差瓦加苏耶普拉卡什·甘蒂寇斯坦丁·狄米绰夫·乔尔杰夫戴维·威廉·伯恩斯蒂莫西·艾伦·迪金森唐纳德·威廉·小基德韦尔拉温德拉·瓦曼·谢诺伊乔恩·布拉德利·拉斯特唐浩延卢奕鹏
Owner QUALCOMM INC
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