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Circuit board, production method thereof and pattern transfer method

A pattern transfer and production method technology, applied in chemical/electrolytic methods to remove conductive materials, printed circuits, patterns and photolithography, etc., can solve problems such as easy cracking of dry films

Inactive Publication Date: 2018-06-05
GUANGZHOU FASTPRINT CIRCUIT TECH +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Based on this, it is necessary to provide a circuit board and its production method and pattern transfer method for the problem that the dry film is easy to break when the large-aperture metallized hole is developed.

Method used

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  • Circuit board, production method thereof and pattern transfer method
  • Circuit board, production method thereof and pattern transfer method

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Embodiment Construction

[0034] Embodiments of the present invention are described in detail below in conjunction with accompanying drawings:

[0035] It should be noted that when an element is “fixed” to another element, it may be directly on the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. In contrast, when an element is referred to as being "directly on" another element, there are no intervening elements present. The terms "vertical," "horizontal," "left," "right," and similar expressions are used herein for purposes of illustration only and are not intended to represent the only embodiments.

[0036] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of the invention. The terminology used herein in the descrip...

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Abstract

The invention relates to a pattern transfer method, which comprises the steps of taking a substrate, and attaching a first dry film to the substrate; performing exposure and development on the first dry film, covering a plated through hole by the first dry film retained after the development, and enabling the spacing between the edge of the first dry film and the edge of the plated through hole toreach a preset spacing requirement; laying a second dry film on the retained first dry film, and enabling the second dry film to be attached to the whole substrate; performing exposure and development on the second dry film according to a preset circuit pattern; etching the substrate according to the preset circuit pattern, and completing the etching; and removing the first dry film and the second dry film to complete the pattern transfer. According to the invention, exposure and development are performed on the first dry film so as to protect the plated through hole in advance, the attachment of the second dry film forms a thicker dry film, thereby playing a role of protecting the plated through hole, avoiding damages imposed on the dry film by the subsequent etching process, thus improving the processing finished product rate of the circuit board, and reducing the production cost.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a circuit board, a production method thereof, and a pattern transfer method. Background technique [0002] PCB (Printed Circuit Board), the Chinese name is printed circuit board, also known as printed circuit board or circuit board, which is the support body of electronic components and the carrier of electrical connection of electronic components. They are called "printed" circuit boards because they are produced electronically. [0003] With the continuous development of the electronics industry, the functions of the PCB are also highly integrated, and the wiring density is getting higher and higher. In high-end electronic products, the line width greater than or equal to 3mil has become a conventional design, and the corresponding PCB vias are used for soldering components. In the process of PCB processing, it is necessary to carry out a pattern transfer process on the...

Claims

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Application Information

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IPC IPC(8): H05K3/06H05K1/11
CPCH05K1/115H05K3/06H05K2203/052H05K2203/0548
Inventor 彭文才乔书晓陈黎阳
Owner GUANGZHOU FASTPRINT CIRCUIT TECH
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