Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Manufacturing method of resistor as well as resistor

A manufacturing method and technology of resistors, which are applied in the direction of adding resistors at lead-out terminals, manufacturing encapsulation/housing resistors, and coating resistor materials, etc., can solve the problems of slurry seepage, poor resistance value accuracy, and easy out-of-tolerance, etc., to achieve Low temperature coefficient of resistance, the effect of avoiding bad slurry seepage

Active Publication Date: 2018-06-01
GUANGDONG FENGHUA ADVANCED TECH HLDG
View PDF6 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The overlapping position of the protective layer of the resistor and the electrode is prone to seepage, resulting in poor resistance accuracy and TCR value (temperature coefficient of resistance temperature coefficient, used to reflect the degree to which the resistance of the material is affected by temperature) is easy High tolerance

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Manufacturing method of resistor as well as resistor
  • Manufacturing method of resistor as well as resistor
  • Manufacturing method of resistor as well as resistor

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0048] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0049] see figure 2 and image 3 , figure 2 is a schematic flow chart of the resistor manufacturing method provided in Embodiment 1 of the present invention, image 3 It is a structural schematic diagram of a resistor manufactured by the resistor manufacturing method provided by the embodiment of the present invention; this embodiment includes steps:

[0050] S11. Obtain a composite board formed by laminating the resistance layer 21 and the insulating substrat...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a manufacturing method of a resistor. The manufacturing method of the resistor comprises the following steps: obtaining a combined plate body which is formed by sticking a resistance layer and an insulating substrate; engraving the resistance layer on the combined plate body to obtain at least one resistor body, wherein the upper surface of the resistor body comprises a resistance area and two electrode areas, and the resistance area and the two electrode areas are not overlapped; printing a mask layer on the resistance area; forming a corresponding upper electrode on each electrode area; and covering the surface of the mask layer with a protective layer to obtain the resistor. Correspondingly, the invention also provides the resistor. High-precision resistance value and low TCR value of the resistor can be realized effectively.

Description

technical field [0001] The invention relates to the technical field of electronic devices, in particular to a method for manufacturing a resistor and the resistor. Background technique [0002] A known resistive element, see figure 1 As shown, the heat dissipation film made of epoxy resin is used to bond the insulating substrate and the alloy resistor body together, and then through etching, oxidation, laser resistance adjustment, printing, electroplating or electroless plating, protection is formed by printing process , respectively forming an internal electrode layer, a protective layer and an external electrode layer on the resistor body to manufacture resistor elements with different resistance values. The overlapping position of the protective layer of the resistor and the electrode is prone to seepage, resulting in poor resistance accuracy and TCR value (temperature coefficient of resistance temperature coefficient, used to reflect the degree to which the resistance o...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01C17/02H01C17/06H01C17/28
CPCH01C17/02H01C17/06H01C17/28
Inventor 袁广华杨理强林瑞芬徐育洲黄石兰刘值源练洁兰
Owner GUANGDONG FENGHUA ADVANCED TECH HLDG
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com