Improved TO-220D7L lead frame

Abstract

The invention discloses an improved TO-220D7L lead frame which includes a plurality of frame units sequentially connected in series by connecting ribs. Each frame unit includes a matrix and a pin area; the matrix includes a radiating fin area and a first chip loading area; the pin area is provided with seven pins; among the fixed pins, one pin is provided with a second chip loading area on the topthereof, and one pin is provided with a connecting piece on the top thereof; the pin area is connected with the matrix through the connecting piece; each of the other fixed pins is provided with a welding part on the top thereof, and the dummy pin is connected with the frame unit as a whole through the connecting ribs; a buffer groove is arranged at the joint of the radiating fin area and the first chip loading area; the radiating fin area is provided with fan-shaped gaps on the two sides thereof, and each fan-shaped gap is provided with a conical blind hole in the side thereof; and the radiating fin area is provided with a first positioning hole, and auxiliary positioning lugs are arranged on the two sides of the first positioning hole. By using the structure, two chips can be installedsimultaneously. The investment is reduced for enterprises. The improved TO-220D7L lead frame has a good waterproof effect and good performance, and has high market competitiveness.

Description

technical field [0001] The invention belongs to the technical field of semiconductor packaging, and in particular relates to an improved TO-220D7L lead frame. Background technique [0002] As the chip carrier of the integrated circuit, the lead frame is a key structural part that realizes the electrical connection between the lead-out end of the chip's internal circuit and the external lead by means of a bonding material, forming an electrical circuit. It acts as a bridge connecting the external wire. Most of the semiconductor integrated blocks need to use lead frames, which are important basic materials in the electronic information industry. Most of the existing lead frames on the market are single-base island lead frames, which can only install one chip, and have a single structure, which cannot meet the needs of the market. For lead frames that require a multi-pin structure, the number of pins is generally fixed. The frame with a large number of pins needs to be equippe...

AI Technical Summary

Problems solved by technology

Most of the existing lead frames on the market are single-base island lead frames, which can only install one chip, and have a single structure, which cannot meet the needs of the market. For lead frames that require a multi-pin structure, the number of pins is generally fixed. The frame with a large number of pins needs to be equipped with supporting plastic packaging and other equipment, and the product investment is relatively large. Therefore, in order to improve the utilization rate of the supporting equipment, the frame should be modified accordingly, so that lead frames with various pin numbers can share a set of instruments, which can greatly reduce the cost. In addition, the existing lead frame structure often has problems such as poor plastic sealing effect, poor insulation effect and poor waterproof effect, and it is difficult to demould during processing, resulting in poor product quality

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