Package structure and package method of integrated tunable antenna array and radio frequency module

Abstract

The invention discloses a package structure and package method of an integrated tunable antenna array and a radio frequency module. The package structure comprises a rigid-flexible board and a radio frequency module package body, wherein the rigid-flexible board is used for arranging an antenna array patch, the radio frequency module package body is used for packaging a radio frequency chip, the rigid-flexible board and the radio frequency module package body are vertically and oppositely arranged and are fastened by four bolts and nuts, the four bolts and nuts are arranged at corners and arematched, and the rigid-flexible board is fixedly connected with one side of the radio frequency module package body by a second flexible substrate. With the package structure of the integrated tunableantenna array and the radio frequency module, fabricated by the invention, the integration of the integrated tunable antenna array and the radio frequency module is achieved, moreover, the tuning ofthe antenna array also can be achieved, the package structure has the characteristics of high integration, good electromagnetic shielding effect, antenna gain, high radiation efficiency, small radiation power and low loss, and the demands of different application occasions can be satisfied.

Description

technical field [0001] The invention relates to the technical field of semiconductor packaging, in particular to a packaging structure and method of a radio frequency module. Background technique [0002] Due to its large bandwidth, low latency, and high speed, 5G networks have broad application prospects in the fields of Internet of Things, Internet of Vehicles, industrial automation, and AR / VR. In order to increase the transmission rate, the 5G network will adopt millimeter wave and MIMO technology in micro base stations and mobile terminals, but the existing antenna arrays and radio frequency modules for mobile terminals and base stations are often integrated separately and connected through long interconnections. This method has the following defects: First, the operating frequency of the antenna is gradually increased, which is very sensitive to the discontinuity of the transmission line, which is easy to cause impedance mismatch; The working frequency band, high match...

AI Technical Summary

Problems solved by technology

[0008] The technical problem to be solved by the present invention is to provide a packaging structure and method for integrating tunable antennas and array radio frequency modules, so as to solve the defects existing when antennas and radio frequency modules are integrated in the millimeter wave band in existing mobile terminals and micro base stations, and further Meet the application requirements of 5G networks

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