Electronic component module and manufacturing method thereof
一种电子部件、制造方法的技术,应用在半导体/固态器件制造、电气元件、电固体器件等方向,能够解决屏蔽剥离、反射率降低等问题,达到附着性高、反射率低的效果
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[0047] The actual production has the same figure 1 The samples of Examples 1 to 4 having the same structure as the electronic component module 1 shown have Image 6 A sample of Example 5 having the same structure as the electronic component module 2 shown.
[0048] First, prepare a sample of an electronic component module as an intermediate product in which an electronic component is mounted on a mounting substrate and the electronic component is sealed with a sealing resin (molding resin) containing a filler made of silica (see Figure 4A ). As the mounting board, an FR4 (Flame Retardant Type 4) resin printed circuit board was used.
[0049] Next, a mask tape is pasted on the bottom surface of the mounting substrate to cover the entire bottom surface of the mounting substrate (see Figure 4B ). Next, a conductive film is formed by electroless plating (see Figure 4C ). In the electroless plating process, first, after immersing the electronic component module in an aqueo...
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