Cooling system for electronic device

Abstract

A cooling system (10) has a cooling tank 12, a second cooling liquid (13) that has a boiling point T2 being placed inside an open space of the cooling tank (12). An electronic device (100) in which aprocessor (110) is mounted as a heat-emitting body on a board (120) is stored inside the open space of the cooling tank (12) and is immersed in the second cooling liquid (13) (boiling point T2). An ebullient cooling device (200) is thermally connected to the processor (110), a first cooling liquid (11) that has a boiling point T1 (where T1=T2 or T1<T2) being sealed in the ebullient cooling device(200). A first heat exchanger (22) is provided with: high-temperature-side flow channels for letting pass the second cooling liquid, the high-temperature-side flow channels comprising an aggregate ofnarrow gaps or minute flow channels; and low-temperature-side flow channels for letting pass a third cooling medium having a boiling point T3 (where T3=T2 or T3<T2), the low-temperature-side flow channels comprising an aggregate of narrow gaps or minute flow channels. The high-temperature-side flow channels and the low-temperature-side flow channels are provided alternately and are separated by walls. A pump (40) pressure-feeds the second cooling liquid (13), which is heated inside the cooling tank (12), toward the inlet to the high-temperature-side flow channels of the first heat exchanger (22).

Description

technical field [0001] The present invention relates to a cooling system for electronic equipment, and more particularly to a cooling system for electronic equipment for efficiently cooling electronic equipment such as supercomputers and data centers that require ultra-high performance and stable operation and that generate a large amount of heat from the electronic equipment itself . Background technique [0002] In recent years, one of the biggest issues determining the limit of the performance of supercomputers is power consumption, and the importance of research on power saving performance of supercomputers has been known to the general public. That is, the speed performance per unit power consumption (Flops / W) becomes an index for evaluating a supercomputer. In addition, in data centers, about 45% of the power consumption of the entire data center is used for cooling, and there are increasing demands for reducing power consumption by improving cooling efficiency. [0...

AI Technical Summary

Problems solved by technology

In addition, it has also been reported that the synthetic oil used corrodes the gaskets constituting the cooling system in a short period of time, causing leakage of the synthetic oil and hindering the operation.

Images