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Material and method for preparing LED bracket through imprint lithography technology

A technology of LED bracket and lithography technology, which is applied in the fields of opto-mechanical equipment, optics, and photo-engraving process of pattern surface, which can solve the problem of waste of energy consumption of bracket materials and materials.

Active Publication Date: 2018-04-13
南通康池新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] In order to overcome the shortcomings of the existing technology and materials, the purpose of the present invention is to provide an imprint lithography technology and corresponding material technology, which can manufacture LED brackets of different sizes on a large scale, and at the same time solve the waste of material energy consumption and reliability of bracket materials question

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  • Material and method for preparing LED bracket through imprint lithography technology
  • Material and method for preparing LED bracket through imprint lithography technology
  • Material and method for preparing LED bracket through imprint lithography technology

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Embodiment Construction

[0038] Hereinafter, the present invention will be specifically described by showing examples, but the present invention is not limited to the following examples.

[0039] refer to figure 1 , a method for preparing LED brackets by imprint lithography technology, using imprint lithography equipment, coating and curing imprint glue on printed circuit boards (PCB) or pins. The imprint lithography equipment includes a flexible composite mold A (1-4), a carrier table 8, and pneumatic, electric, vacuum, and electrostatic systems. Embossing glue is a liquid or solid material, including resin, filler, functional additives, photosensitive additives and curing components.

[0040] Such as figure 1 As shown in A, the flexible composite mold A is adsorbed on the electronically controlled manipulator by vacuum; figure 1 As shown in B, the pins to be processed or the PCB board are installed on the sample carrier 8 .

[0041] Apply embossing glue to pins or PCB boards by one or more metho...

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PUM

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Abstract

The invention discloses LED bracket preparation technology, and particularly relates to a preparation process and related material technology. The LED preparation technology according to the inventioncomprises the steps of applying liquid imprint glue on a printed circuit board (PCB) with arranged circuit or a pin, and obtaining a large-area manufactured LED bracket at an original position through an imprint template. The imprint template is a flexible composite die. Through function of an external electric field or vacuum, a template contacts with a substrate, thereby realizing patterning ofliquid imprint glue. After illumination, the liquid imprint glue is solidified, and furthermore demolding developing is performed. The liquid imprint glue is composed of epoxy resin, acrylic acid ester, a filling material, a pigment, a photoinitiator, a curing agent, etc. The obtained LED bracket can be further cut for use or directly used in a large-area manner.

Description

technical field [0001] The invention relates to an embossing photolithography technology and related materials for manufacturing LED brackets in a large area on a PCB board or pins. Through imprint lithography technology, large-area in-situ fabrication of LED brackets ranging from millimeters to micrometers can be achieved. Using liquid embossing glue, LED brackets with excellent curability, good bonding performance and excellent reliability can be realized quickly and without waste. Background technique [0002] Traditional LED devices mainly use thermoplastic (Thermoplastic Plastics) plastic encapsulation brackets, and the resin materials are mostly PPA, PA6T, PA9T, PCT, etc. Due to the use of injection molding, the flow channel materials are repeatedly processed, resulting in long processes and performance degradation. LED devices packaged in thermoplastic encapsulation brackets have problems such as heat dissipation, air tightness, heat resistance, and light decay resis...

Claims

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Application Information

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IPC IPC(8): H01L33/48G03F7/00
CPCG03F7/0002H01L33/483H01L2933/0033
Inventor 余英丰郑辉顾炜
Owner 南通康池新材料有限公司
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