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Water-cooled radiator and heat-dissipating system

A technology of water-cooling and radiator, which is applied in the direction of electric solid-state devices, semiconductor devices, semiconductor/solid-state device components, etc., can solve the problems of poor heat dissipation effect of radiators, achieve accurate and reliable experimental results, stable heat process, and accelerated The effect of a large contact area

Pending Publication Date: 2018-04-13
CHINA ZHENHUA GRP YUNKE ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] One of the objects of the present invention is to provide a water-cooled radiator, which aims to solve the problem of poor heat dissipation effect of radiators in the prior art;
[0006] Another object of the present invention is to provide a heat dissipation system, which aims to solve the problem of poor heat dissipation effect of radiators in the prior art

Method used

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  • Water-cooled radiator and heat-dissipating system
  • Water-cooled radiator and heat-dissipating system
  • Water-cooled radiator and heat-dissipating system

Examples

Experimental program
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Effect test

Embodiment 1

[0036] Please refer to figure 1 , with reference to Figure 2 to Figure 3 , the present embodiment provides a heat dissipation system, which includes a water-cooled radiator 1, the water-cooled radiator 1 is mainly used for heat dissipation of high-power products.

[0037]Further, the water-cooled radiator 1 includes a heat dissipation plate 2, and the heat dissipation plate 2 has a first side end and a second side end opposite to each other, wherein a water inlet 3 is opened on the first side end, and an outlet opening is opened on the second side end. The water port 4, the structure of the water inlet 3 and the water outlet 4 are identical and both are on the same straight line. At the same time, a fluid channel 5 is opened on the cooling plate 2, and the fluid channel 5 extends from the water inlet 3 to the water outlet 4. The fluid channel 5 has a first inner wall and a second inner wall opposite to each other, and the first inner wall and the second inner wall A plurali...

Embodiment 2

[0044] Please refer to Figure 4 and Figure 5 , with reference to figure 1 , the structure of the water-cooled radiator 1 in this embodiment is substantially the same as that in the first embodiment, and the difference is that the structure of the barrier member 6 is different from that in the first embodiment.

[0045] In this embodiment, the barrier member 6 is a plate-shaped structure, on which a horizontal turbulence 12 is arranged, wherein the horizontal turbulence 12 includes a hydraulic cylinder 13, a connecting shaft 14 and a turbulent head 15, and the hydraulic cylinder 13 Installed inside the barrier 6, one end of the connecting shaft 14 is connected to the output shaft of the hydraulic cylinder 13, and the other end passes through the barrier and is connected to the stirring head 15. When the hydraulic cylinder 13 is activated, the hydraulic cylinder 13 can drive The stirring head 15 reciprocates along the axial direction of the barrier member 6 .

[0046] Speci...

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Abstract

The invention provides a water-cooled radiator and a heat-dissipating system and belongs to the technical field of radiators. The water-cooled radiator includes a heat-dissipating plate. A water inletand a water outlet are disposed on the opposite side ends of the heat-dissipating plate respectively. The heat-dissipating plate is provided with a fluid channel. The fluid channel extends from the water inlet to the water outlet, and is provided therein with multiple stoppers distributed at intervals. The axial direction of the stoppers and the axial direction of the heat-dissipating plate are angled. The heat-dissipating system has the water-cooled radiator, is simple in structure, and easy to use, and has a good heat dissipation effect.

Description

technical field [0001] The invention relates to the technical field of radiators, in particular to a water-cooled radiator and a heat dissipation system. Background technique [0002] With the continuous development of electronic technology, the integration of electronic products is getting higher and higher, the frequency is getting faster and the power is getting bigger and bigger. The continuous introduction of high-power electronic components and equipment makes the demand for heat sinks with high efficiency and high performance increasingly urgent. [0003] At present, known radiators, some use fans to dissipate heat, and some use copper-aluminum media to conduct heat and dissipate heat. There are also liquid circulation radiators and heat pipe radiators (the inside of the heat pipe mainly utilizes the vapor and liquid phase change heat transfer of the liquid). But they all have their own deficiencies, such as poor heat transfer, noise, breakage or demanding operating ...

Claims

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Application Information

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IPC IPC(8): H01L23/367H01L23/473
CPCH01L23/3672H01L23/473
Inventor 罗国兴韩玉成胡志亮冷俊龙辉
Owner CHINA ZHENHUA GRP YUNKE ELECTRONICS
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