Package structures

Abstract

A package structure is provided. The package structure includes a leadframe including a plurality of connection portions; a device including a substrate, an active layer disposed on the substrate anda plurality of electrodes disposed on the active layer, wherein the electrodes of the device are connected to the connection portions of the leadframe; a conductive unit having a first side and a second side, wherein the first side of the conductive unit connects to the substrate of the device and the conductive unit connects to at least one of the connection portions of the leadframe; and an encapsulation material covering the device and the leadframe, wherein the second side of the conductive unit is exposed from the encapsulation material.

Description

technical field [0001] The present disclosure relates to a package structure, in particular to a package structure with at least partially exposed conductive units. Background technique [0002] Flip chip packaging describes the method of electrically connecting a die to a package carrier. A package carrier, such as a substrate or leadframe, provides connections from the die to the outside of the package. In standard packaging processes, wires are used to form the interconnects between the die and the carrier. The die is attached to the carrier face up, and then the wires are first bonded to the die, then wrapped around and bonded to the carrier. Generally, the length of the wire is between 1-5 cm and the diameter is between 15-35 microns. [0003] In contrast, in flip-chip packaging, the interconnection between the die and the carrier is formed through conductive bumps placed directly on the surface of the die. Place the bumped die upside down so that the bumps are dire...

AI Technical Summary

Problems solved by technology

[0006] However, the solid copper bridges (such as copper clips) used in clip bonding packages are also encapsulated by packaging materials, resulting in poor heat dissipation of the packaged copper clips.

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