Chip type tantalum capacitor having metal packaging structure and packaging method of chip type tantalum capacitor

Abstract

A chip tantalum capacitor with a metal package structure and a package method thereof, adopting a metal package structure, wrapping a layer of bonding conductive glue on the outside of the tantalum chip, and then wrapping a layer of metal shell on the outside of the bonding conductive glue; One end is connected with a tantalum wire, and the tantalum wire is led out of the metal shell through the lead wire of the tantalum wire to form a chip tantalum capacitor with a metal package structure. The tantalum wire and the lead wire of the tantalum wire are connected by welding, and the welding point of the tantalum wire and the lead wire of the tantalum wire is located on the inner surface of the metal shell, and the welding point of the tantalum wire and the lead wire of the tantalum wire is covered with an insulating block, The space between the insulating block and the tantalum chip and the outside of the insulating block is also wrapped with adhesive conductive glue, so that the space between the tantalum chip, the tantalum wire and the lead wire of the tantalum wire, and the shell is relatively fixed.

Description

technical field [0001] The invention relates to an electronic component and a manufacturing method thereof, in particular to a chip tantalum capacitor with a metal package structure and a manufacturing method thereof, so as to solve the problem of airtightness of resin packaged products, improve its reliability, and maintain a chip appearance at the same time Designed for ease of installation and use. It belongs to the technical field of making electronic components. Background technique: [0002] Chip solid tantalum capacitor is a polar component. In microelectronic circuits, the unidirectional conductivity of its dielectric layer can be used for filtering to filter out or reduce the amplitude of the remaining AC ripple signal in the DC signal. , The chip solid tantalum capacitor is characterized by long life, high temperature resistance, high accuracy, excellent high-frequency harmonic filtering performance, and various forms, excellent volume efficiency, has its unique c...

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to propose a new chip solid tantalum capacitor and its manufacturing method in view of the shortcomings of the existing chip solid tantalum capacitor resin packaging method. The chip solid tantalum capacitor and its manufacturing method can effectively solve chip Type solid tantalum capacitors are vulnerable to the intrusion of moisture or corrosive gases and liquids in harsh environments such as high temperature and high humidity, and damage the internal conduction lines and cores of the device, resulting in deterioration of product performance or even failure.