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A kind of low-silver solder for vacuum electronic device sealing and preparation method thereof

A technology of vacuum electronic devices and silver solder, which is applied in the direction of welding equipment, welding/cutting media/materials, manufacturing tools, etc., to achieve the effect of reducing the electroplating process, small solid-liquid phase temperature difference, and excellent brazing performance

Active Publication Date: 2021-04-16
BEIJING INST OF NONFERROUS METALS & RARE EARTH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, the above two solders are not suitable for vacuum brazing of uncoated materials

Method used

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  • A kind of low-silver solder for vacuum electronic device sealing and preparation method thereof
  • A kind of low-silver solder for vacuum electronic device sealing and preparation method thereof
  • A kind of low-silver solder for vacuum electronic device sealing and preparation method thereof

Examples

Experimental program
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Effect test

preparation example Construction

[0032] Its preparation method comprises the following steps:

[0033] 1) Weigh silver (Ag), oxygen-free copper, gallium (Ga) and nickel (Ni) according to the composition ratio. The purity of silver (Ag) and gallium (Ga) is both 99.99% (mass %), and the purity of nickel (Ni) is 99.9% (mass %) or more.

[0034] 2) Vacuum continuous casting: Put the silver, oxygen-free copper, gallium and nickel raw materials weighed above into the horizontal continuous casting furnace, and when the vacuum is lowered to 0.1Pa, raise the temperature. Refining at ℃ for 5-10 minutes, and then drawing at 900-920 ℃, casting speed: 2-4mm / s, cooling water flow rate at 2L / min, continuously casting AgCuGaNi alloy ingots with a thickness of 10mm and a width of 265mm . After the raw materials are completely melted and before refining, you can choose to keep warm for a period of time, and the holding time is 20-40min.

[0035] 3) Solution heat treatment: heat preservation at 690°C to 720°C for 30 to 45 mi...

Embodiment 1

[0041] Weigh 5.0Kg gallium, 42.0Kg silver, 2.0Kg nickel and 51.0Kg copper, put them into the horizontal continuous casting furnace for melting, and evacuate to 1.0×10 -1Pa, heat up, refine at 880°C for 10min, start drawing at 900°C, casting speed 2mm / s, cooling water flow rate 2L / min, the resulting product contains Ag 42.0wt%, Cu 51.0wt%, Ga 5.0wt% , Ni 2.0wt% alloy ingot. Then solution heat treatment at 700°C for 40min; rolling to 0.2mm with a two-roll rolling mill; annealing at 360°C for online stretching and straightening heat treatment, the running speed of the sheet is controlled at 4m / min, and the tension for stretching and straightening is preset to 0.8KN. The elongation is preset to 1.0%. Finally, finish rolling to obtain AgCuGaNi foil-shaped low-silver solder with a thickness of 20 μm and a width of 250 mm.

[0042] like figure 1 Shown is the differential thermal curve of the Ag-Cu-Ga-Ni alloy obtained in Example 1. It can be seen from the figure that the melting ...

Embodiment 2

[0045] Weigh 4.0Kg gallium, 44.0Kg silver, 1.5Kg nickel and 50.5Kg copper, put them into a horizontal continuous casting furnace for melting, and vacuumize to 10 -1 Below Pa, heat up, refine at 890°C for 8 minutes, start drawing at 920°C, casting speed 3mm / s, cooling water flow rate 2L / min, the resulting product contains Ag 44.0wt%, Cu 50.5wt%, Ga 4.0wt %, Ni 1.5wt% alloy ingot. Then solution heat treatment at 690°C for 45 minutes; rolling to 0.3mm with a two-roll rolling mill; annealing at 400°C for online stretching and straightening heat treatment, the running speed of the sheet is controlled at 5m / min, and the tension for stretching and straightening is preset to 0.6KN. The elongation is preset to 1.0%. Finally, finish rolling to obtain AgCuGaNi foil-shaped low-silver solder with a width of 20 μm and a width of 250 mm.

[0046] The obtained solder had a solidus temperature of 782°C and a liquidus temperature of 805°C. The brazing material is used to carry out the sealin...

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Abstract

The invention discloses a low-silver brazing material for vacuum electronic device sealing and a preparation method thereof, belonging to the technical field of brazing materials. In terms of mass percentage, the composition is: Ag 42.0%-48.0%, Ga 3.0%-5.0%, Ni 0.1%-2.0%, and the balance is Cu. Using the method of "vacuum continuous casting-solution heat treatment-rolling-on-line stretching and straightening heat treatment-finish rolling", a wide and extremely thin strip with a thickness of 20 μm and a width of 250 mm can be prepared. The preparation method is simple and conducive to mass production. The melting temperature of this low-silver solder is equivalent to that of AgCuNi solder. It has good brazing processability, good wettability, low silver content, low vapor pressure, etc., and the soldering rate to oxygen-free copper, nickel and other materials is higher than 99 %; weld tensile strength σ b ≥150MPa; used for sealing vacuum devices such as vacuum tubes, the package leakage rate is ≤1.0×10 ‑11 Pam 3 / s.

Description

technical field [0001] The invention relates to a low-silver solder used for sealing vacuum electronic devices and a preparation method thereof. The low-silver solder is mainly used for brazing connections of vacuum electronic devices and belongs to the technical field of brazing materials. Background technique [0002] Silver-based solder has excellent physical properties, processing properties and welding properties, and is widely used in the welding of vacuum electronic devices, and plays an important role in promoting the development of important fields such as electric power, aerospace, aviation, navigation, and military affairs. At present, the silver-based solders widely used in the brazing of structural materials of vacuum electronic devices are mainly AgCu28 and AgCu50 series alloys, and the silver content of the above solders is more than 50%. [0003] With the development of the electronics industry, the structure of vacuum electronic devices is becoming more and ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/30B23K35/40
CPCB23K35/30B23K35/40
Inventor 柳旭张国清马会斌焦磊王冉王峰杜旭明李艳涛刘广华
Owner BEIJING INST OF NONFERROUS METALS & RARE EARTH
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