Lithographic apparatus and device manufacturing method

A technology of substrate and data set, applied in the field of manufacturing devices

Active Publication Date: 2018-03-27
ASML NETHERLANDS BV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, such overlay measurements can also be affected by deformation of the overlay mark

Method used

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  • Lithographic apparatus and device manufacturing method
  • Lithographic apparatus and device manufacturing method
  • Lithographic apparatus and device manufacturing method

Examples

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Embodiment Construction

[0038] figure 1 A lithographic apparatus according to an embodiment of the invention is schematically depicted. The apparatus comprises an illumination system (illuminator) IL configured to condition a radiation beam B (e.g. UV radiation or any other suitable radiation), configured to support a patterning device (e.g. a mask) MA and connected to a first The mask support structure (eg mask table) MT of the positioning means PM, the first positioning apparatus PM is configured to accurately position the patterning means according to certain parameters. The apparatus also includes a substrate table (e.g., wafer table) WT or "substrate support" configured to hold a substrate (e.g., a resist-coated wafer) W and connected to a second positioning apparatus PW, p. The second positioning device PW is configured to accurately position the substrate according to certain parameters. The apparatus also includes a projection system (e.g., a refractive projection lens system) configured t...

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PUM

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Abstract

A method of characterizing a deformation of a plurality of substrates is described. The method comprising the steps of: - measuring, for a plurality of n different alignment measurement parameters lambda and for a plurality of substrates, a position of the alignment marks; - determining a positional deviation as the difference between the n alignment mark position measurements and a nominal alignment mark position; - grouping the positional deviations into data sets; - determining an average data set; - subtracting the average data set from the data sets to obtain a plurality of variable datasets; - performing a blind source separation method on the variable data sets, thereby decomposing the variable data sets into a set of eigenwafers representing principal components of the variable data sets; - subdividing the set of eigenwafers into a set of mark deformation eigenwafers and a set of substrate deformation eigenwafers.

Description

[0001] Cross References to Related Applications [0002] This application claims priority to EP application 15176521.1 filed on 13 July 2015 and EP application 16175702.6 filed on 22 June 2016, the entire contents of which are incorporated herein by reference. technical field [0003] The present invention relates to a method of characterizing the deformation of a plurality of substrates, an alignment method for substrates, an alignment system, a lithographic apparatus, an overlay measurement method, a metrology system and a method for manufacturing a device. Background technique [0004] A lithographic apparatus is a machine that applies a desired pattern to a substrate, usually to a target portion of the substrate. A lithographic apparatus may be used, for example, in the manufacture of integrated circuits (ICs). In this case, a patterning device, alternatively referred to as a mask or reticle, may be used to generate the circuit pattern to be formed on the individual la...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F9/00G03F7/20
CPCG03F7/70508G03F7/70633G03F9/7046G03F9/7092G03F7/70141G03F9/7088
Inventor F·G·C·比恩A·J·登博夫R·J·F·范哈伦P·A·J·廷尼曼斯A·雅玛I·A·莱利娜E·M·休瑟博斯H·E·切克利柳星兰L·J·P·维尔希斯V·E·卡拉多L·P·范迪克
Owner ASML NETHERLANDS BV
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