A kind of encapsulation adhesive, encapsulation structure and gluing device

A glue coating device and encapsulation glue technology, which is applied in transportation and packaging, other household appliances, synthetic resin layered products, etc., can solve the problem of expanding the range of non-display areas, easy peeling of the edge of the cover and substrate, and affecting the performance of OLED devices, etc. problem, to achieve the effect of border and narrow border

Active Publication Date: 2020-11-10
BOE TECH GRP CO LTD
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  • Claims
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Problems solved by technology

[0005] The embodiment of the present invention provides a packaging glue, packaging structure and glue coating device, which solves the problem that the edge of the cover plate and the substrate is easily peeled off caused by placing the desiccant on the cofferdam glue in the prior art. The problem of expanding the range of non-display areas in the enclosed area and the problem of dispersing the desiccant in the filling gel to affect the performance of OLED devices

Method used

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  • A kind of encapsulation adhesive, encapsulation structure and gluing device
  • A kind of encapsulation adhesive, encapsulation structure and gluing device
  • A kind of encapsulation adhesive, encapsulation structure and gluing device

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Embodiment Construction

[0031] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0032] An embodiment of the present invention provides an encapsulation glue 60, such as figure 2 As shown, it includes a first colloidal layer 601 and a second colloidal layer 602 covering the first colloidal layer 601 ; the first colloidal layer 601 includes a colloid 603 and a desiccant 604 dispersed in the colloid 603 .

[0033] It should be noted that, first, the composition of the colloid 603 in the first colloid layer 601 and the colloid composition of...

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Abstract

The embodiment of the present invention provides an encapsulation glue, an encapsulation structure, and an gluing device, which relate to the field of display technology and solve the problem in the prior art that the edge of the cover plate and the substrate is easily peeled off caused by placing the desiccant on the cofferdam glue. The problem of enlarging the range of the non-display area in the area surrounded by the cofferdam glue and the problem of affecting the performance of the OLED device by dispersing the desiccant in the filling glue. The packaging glue includes a first colloid layer and a second colloid layer wrapping the first colloid layer; the first colloid layer includes colloid and a desiccant dispersed in the colloid. Used for encapsulation.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a packaging glue, a packaging structure and a glue coating device. Background technique [0002] Organic Light-Emitting Diode (OLED) is a display lighting technology gradually developed in recent years, especially in the display industry, because of its advantages of high response, high contrast, and flexibility, it is considered to have Wide application prospects. However, since OLED devices will be corroded and damaged under the action of water vapor and oxygen, it is particularly important to choose a better packaging method for OLED devices. [0003] At present, commonly used OLED packaging methods include sheet glue packaging, glass glue packaging (ie, Frit packaging), cofferdam glue and filling glue packaging (ie, Dam and Fill packaging), and the like. Among them, the Dam and Fill packaging methods are specifically shown in Figure 1 (a), coating a circle of cofferdam glu...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L51/52H01L51/56H01L51/00
CPCH10K71/00H10K50/8426C09J133/02C09J133/04C08K2003/222C08K2003/2206B29C48/022B29C48/06B29C48/16B29C48/475B32B2307/732B32B2250/02B32B2307/724B32B15/08B32B9/045B32B7/12B32B9/041B32B2307/728B32B2457/206B32B17/06H10K50/846B32B27/20B32B27/308C09J11/04B32B2264/102C08K3/08Y10T428/25H10K2102/00H10K2102/331
Inventor 罗程远
Owner BOE TECH GRP CO LTD
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