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Packaging adhesive, packaging structure and adhesive spreading device

A technology of gluing device and packaging structure, which is applied in the directions of transportation and packaging, adhesive type, electronic equipment, etc., can solve the problems of expanding the non-display area, easy peeling of the edge of the cover plate and substrate, affecting the performance of OLED devices, etc. Achieving narrow borders and realizing the effect of borders

Active Publication Date: 2018-03-13
BOE TECH GRP CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The embodiment of the present invention provides a packaging glue, packaging structure and glue coating device, which solves the problem that the edge of the cover plate and the substrate is easily peeled off caused by placing the desiccant on the cofferdam glue in the prior art. The problem of expanding the range of non-display areas in the enclosed area and the problem of dispersing the desiccant in the filling gel to affect the performance of OLED devices

Method used

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  • Packaging adhesive, packaging structure and adhesive spreading device
  • Packaging adhesive, packaging structure and adhesive spreading device
  • Packaging adhesive, packaging structure and adhesive spreading device

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Embodiment Construction

[0031] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0032] An embodiment of the present invention provides an encapsulation glue 60, such as figure 2 As shown, it includes a first colloidal layer 601 and a second colloidal layer 602 covering the first colloidal layer 601 ; the first colloidal layer 601 includes a colloid 603 and a desiccant 604 dispersed in the colloid 603 .

[0033] It should be noted that, first, the composition of the colloid 603 in the first colloid layer 601 and the colloid composition of...

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Abstract

The embodiment of the invention provides a packaging adhesive, a packaging structure and an adhesive spreading device, relates to the technical field of display and aims at solving the problem that acover board is easily peeled off from the edge of a substrate due to the fact that a drying agent is put on a dam adhesive, the problem that a non-display area range is expanded due to the fact that the drying agent is put into an area surrounded by the dam adhesive and the problem that the performance of an OLED device is affected due to the fact that the drying agent is dispersed into a fill adhesive in the prior art. The packaging adhesive comprises a first colloid layer and a second colloid layer coating the first colloid layer; and the first colloid layer comprises colloid and the dryingagent dispersed into the colloid. The packaging adhesive is used for carrying out packaging.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a packaging glue, a packaging structure and a glue coating device. Background technique [0002] Organic Light-Emitting Diode (OLED) is a display lighting technology gradually developed in recent years, especially in the display industry, because of its advantages of high response, high contrast, and flexibility, it is considered to have Wide application prospects. However, since OLED devices will be corroded and damaged under the action of water vapor and oxygen, it is particularly important to choose a better packaging method for OLED devices. [0003] At present, commonly used OLED packaging methods include sheet glue packaging, glass glue packaging (ie, Frit packaging), cofferdam glue and filling glue packaging (ie, Dam and Fill packaging), and the like. Among them, the Dam and Fill packaging methods are specifically shown in Figure 1 (a), coating a circle of cofferdam glu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/52H01L51/56H01L51/00H10K99/00
CPCH10K50/8426H10K50/846C09J133/02C09J133/04C08K2003/222C08K2003/2206B29C48/022B29C48/06B29C48/16B29C48/475B32B2307/732B32B2250/02B32B2307/724B32B15/08B32B9/045B32B7/12B32B9/041B32B2307/728B32B2457/206B32B17/06B32B27/20B32B27/308C09J11/04B32B2264/102C08K3/08Y10T428/25H10K2102/00H10K2102/331
Inventor 罗程远
Owner BOE TECH GRP CO LTD
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