Integrated chip crack detection device and method

Abstract

The invention discloses an integrated chip crack detection device and method. The device comprises a control unit, a sensing unit and an excitation unit which are mutually connected, wherein under control of the control unit, the excitation unit can generate a linear laser beam; the linear laser beam irradiates to the surface of a semiconductor chip to perform horizontal and longitudinal scan on the surface of the semiconductor chip; meanwhile, the linear laser beam can generate thermal wave at the position a required excitation line, thermal reaction of the thermal wave is caught by the sensing unit, and thermal reaction data is transmitted to the control unit. The integrated chip crack detection device disclosed by the invention achieves non-contact, no-damage and non-invasion detectionrecognition on cracks of the surface of an integrated chip, is not limited by chip materials, has a high detection efficiency, is suitable for online detection and further improves crack detection capacity and reliability and safety of the integrated chip.

Description

technical field [0001] The invention relates to the field of integrated circuits, in particular to an integrated chip crack detection device and method. Background technique [0002] An integrated circuit, also known as a chip, is a miniature electronic device or component, generally a semiconductor material, known as the "heart" of industrial production. In the development and manufacturing process of chips, people's demand for lighter and thinner electronic products is increasing day by day. Therefore, manufacturers are required to manufacture smaller, thinner, and higher-performance integrated chips. However, the thinning of wafers for integrated chips has brought a series of problems. One of the main problems is the formation of defective products due to surface cracks during chip fabrication. There is a growing need to inspect integrated chips for surface cracks during the manufacturing process as surface cracks can degrade the performance and reliability of the fina...

AI Technical Summary

Problems solved by technology

In recent years, some detection technologies have also been proposed, but their application value is limited due to their own technical reasons and the blankness of key technical content.

[0004] Overall, although many detection technologies for chip crack detection have been proposed so far, there are still key technical problems and defects that limit their development and practical engineering applications.

The disadvantages of the impact test technology listed above must be in contact with the target chip, which will cause potential damage to the chip; the strong eddy current used in the eddy current sensing technology will not only cause a certain degree of damage to the chip, but also affect its performance. effect, and this technique is not suitable for non-conductive materials

The terahertz wave in the terahertz imaging technology has a shallow penetration depth, and more importantly, it is not suitable for metal materials because it cannot penetrate the metal layer; although the scanning acoustic wave microscopy technology has a deeper penetration depth than the terahertz wave, However, due to its long detection time, it is not suitable for online detection. In addition, it is required that the target chip to be detected must be submerged in water or at least covered with water droplets, which may cause other damage to the chip.

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