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Micro device transfer equipment, method for transferring micro devices by adopting same and micro device transfer board

A transfer device and transfer plate technology, which is applied in the direction of instruments, nonlinear optics, optics, etc., can solve the problems of time-consuming and low efficiency, and achieve the effect of improving manufacturing efficiency

Active Publication Date: 2018-03-09
TCL CHINA STAR OPTOELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The above technical solutions are less efficient
Since the number of devices that need to be set in the display panel is often large, it takes a lot of time to set the devices in the display panel using the above technical solution

Method used

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  • Micro device transfer equipment, method for transferring micro devices by adopting same and micro device transfer board
  • Micro device transfer equipment, method for transferring micro devices by adopting same and micro device transfer board
  • Micro device transfer equipment, method for transferring micro devices by adopting same and micro device transfer board

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Embodiment Construction

[0024] The word "embodiment" as used in this specification means an example, instance or illustration. Furthermore, as used in this specification and the appended claims, the article "a" or "an" may generally be construed as "one or more" unless specified otherwise or clear from the context in the singular.

[0025] refer to figure 1 and figure 2 , figure 1 is a schematic diagram of the positional relationship between the device transfer device of the present invention and the array substrate 102 on which the device 104 is to be placed, figure 2 It is a schematic diagram of the process of transferring the device 104 to the array substrate 102 by the device transferring device of the present invention.

[0026] The device transfer device of the present invention includes a carrier platform 101 , a device transfer plate 103 and a magnetic member 105 . The device (Micro Device) 104 of the present invention can be, for example, a Micro Light Emitting Diode (Micro LED).

[0...

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PUM

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Abstract

The invention discloses micro device transfer equipment, a method for transferring micro devices by adopting the same and a micro device transfer board. The equipment comprises a bearing platform, themicro device transfer board and magnetic components, wherein the bearing platform comprises a bearing surface which is used for bearing an array substrate of to-be-received micro devices; the micro device transfer board comprises an attachment surface which is used for allowing to-be-transferred micro devices to be attached to, and the micro device transfer board is used for moving the to-be-transferred micro devices to the position above the bearing platform and enabling the to-be-transferred micro devices to face the array substrate; the magnetic components are arranged in the bearing platform or arranged on the surface, back to the bearing surface, of the bearing platform, and are used for generating magnetic fields and applying magnetic field acting force to the to-be-transferred micro devices when the to-be-transferred micro devices are located above the array substrate; the micro device transfer board is further used for releasing the micro devices when the to-be-transferred micro devices are located above the array substrate, so that the micro devices are transferred to the preset positions of the array substrate under the joint action of the gravity and the magnetic fieldacting force. A large number of micro devices can be rapidly arranged on the array substrate.

Description

【Technical field】 [0001] The invention relates to the field of display technology, in particular to a device transfer device, a device transfer method, and a device transfer plate. 【Background technique】 [0002] With the development of technology, some display panels need to implant (dispose) multiple devices (for example, Micro LED) during the manufacturing process. [0003] In order to place multiple devices on the display panel during the process of manufacturing the display panel, the traditional technical solution is: use an implant device to align the devices to be arranged with predetermined positions in the display panel one by one, and then place the devices one by one (fixed) in the display panel. [0004] The technical solutions described above are less efficient. Since the number of devices to be arranged in the display panel is often large, it takes a lot of time to arrange the devices in the display panel using the above technical solution. [0005] Therefo...

Claims

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Application Information

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IPC IPC(8): G02F1/13
CPCG02F1/1303
Inventor 陈黎暄
Owner TCL CHINA STAR OPTOELECTRONICS TECH CO LTD
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