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Preparation method of toughening conducting material

A conductive material and toughening technology, which is applied in the field of preparation of toughened conductive materials, can solve the problems of unstable mechanical properties of materials, decline of mechanical properties of materials, difficulty in processing and molding, etc., achieve excellent electrical conductivity and mechanical properties, and meet market demand Effect

Inactive Publication Date: 2018-03-06
SUZHOU KEMAO ELECTRONICS MATERIALS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing structural conductive polymer materials on the market have not been actively promoted and used due to factors such as difficult processing and unstable mechanical properties of materials
However, the large amount of conductive fillers needed to be added to prepare composite conductive polymers leads to a decrease in the mechanical properties of the material, especially the significant decrease in the toughness of the material.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] S1: Weigh 5 parts of carbon fibers and 3 parts of carbon nanotubes into 50 parts of hydrochloric acid solution with a concentration of 2 mol / L, treat at 30°C for 1 hour, then ultrasonically stir for 1 hour, and filter to obtain a filter cake;

[0020] S2: Add 10 parts of N-methylolphthalimide and 8 parts of n-butyl isocyanate to the filter cake obtained in step S1, adjust the pH value to 7.5, and continue stirring for 30 minutes;

[0021] S3: Add 25 parts of polypropylene / polyethylene mixture to the substance obtained in step S2, the mass ratio of polypropylene and polyethylene is 1:1, mix and stir for 40min at a temperature of 70°C; then put it into a mold for thermocompression molding , the toughened conductive material can be obtained, wherein the hot pressing temperature is 180° C., the pressure is 15 MPa, and the holding time is 20 minutes.

Embodiment 2

[0023] S1: Weigh 10 parts of carbon fibers and 7 parts of carbon nanotubes into 60 parts of hydrochloric acid solution with a concentration of 5 mol / L, treat at 50°C for 3 hours, then ultrasonically stir for 2 hours, and filter to obtain a filter cake;

[0024] S2: Add 20 parts of N-methylolphthalimide and 15 parts of n-butyl isocyanate to the filter cake obtained in step S1, adjust the pH value to 8.5, and continue stirring for 40 minutes;

[0025] S3: Add 35 parts of polypropylene / polyethylene mixture to the material obtained in step S2, the mass ratio of polypropylene and polyethylene is 3:1, mix and stir for 60 minutes at a temperature of 80°C; then put it into a mold for thermocompression molding , the toughened conductive material can be obtained, wherein the hot pressing temperature is 200° C., the pressure is 20 MPa, and the holding time is 30 minutes.

Embodiment 3

[0027] S1: Weigh 7 parts of carbon fibers and 5 parts of carbon nanotubes and add them to 52 parts of hydrochloric acid solution with a concentration of 3mol / L, treat at a temperature of 35°C for 1.5h, then ultrasonically stir for 1.5h, and filter to obtain a filter cake;

[0028] S2: Add 12 parts of N-methylolphthalimide and 10 parts of n-butyl isocyanate to the filter cake obtained in step S1, adjust the pH value to 7.8, and continue stirring for 32 minutes;

[0029] S3: Add 30 parts of polypropylene / polyethylene mixture to the substance obtained in step S2, the mass ratio of polypropylene and polyethylene is 1.5:1, mix and stir for 45min at a temperature of 72°C; then put it into a mold for thermocompression molding , the toughened conductive material can be obtained, wherein the hot pressing temperature is 185° C., the pressure is 18 MPa, and the holding time is 22 minutes.

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PUM

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Abstract

The invention discloses a preparation method of a toughening conducting material. The preparation method comprises the following steps: weighing carbon fiber and carbon nano tubes into a hydrochloricacid solution with the concentration of 2 to 5 mol / L, treating the solution for 1 to 3 h at the temperature of 30 to 50 DEG C, then carrying out ultrasonic stirring treatment for 1 to 2 h, and filtering to obtain a filter cake; adding N-hydroxymethyl phthalimide and butyl isocyanate into the filter cake, adjusting the PH value to be 7.5 to 8.5, and continuously stirring for 30 to 40 min; adding apolypropylene / polyethylene mixture into the obtained substance, and mixing the solution for 40 to 60 min at the temperature of 70 to 80 DEG C, wherein the mass ratio of polypropylene to polyethylene is 1 to 3 to 1; then putting the mixture in a mold for hot press molding to obtain the toughening conducting material.

Description

technical field [0001] The invention belongs to the field of electronic materials, in particular to a preparation method of a toughened conductive material. Background technique [0002] Polymer conductive materials are usually divided into two categories: composite type and structural type: ①Composite polymer conductive materials. It is made of general-purpose polymer materials and various conductive substances through filling compounding, surface compounding or lamination compounding. The main varieties are conductive plastics, conductive rubber, conductive fiber fabrics, conductive coatings, conductive adhesives and transparent conductive films. Its performance has a great relationship with the type, amount, particle size and state of conductive fillers and their dispersion state in polymer materials. Commonly used conductive fillers are carbon black, metal powder, metal foil, metal fiber, carbon fiber, etc. ②Structural polymer conductive material. It refers to the po...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L23/12C08L23/06C08K9/04C08K9/02C08K7/06C08K7/24
CPCC08L23/12C08K2201/001C08K2201/011C08L23/06C08K9/04C08K9/02C08K7/06C08K7/24
Inventor 邹黎清
Owner SUZHOU KEMAO ELECTRONICS MATERIALS TECH
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