Chip cooling system

Abstract

The invention relates to a chip cooling system comprising a semiconductor cooler used for actively exchanging heat in a transporting manner, and a chip radiator used for performing heat convection, wherein the semiconductor cooler is connected with a power supply; one side of the semiconductor cooler is a heating end while the other side is a cooling end, the heating end can be fit with a chip tobe cooled, and the cooling end is fit with the chip radiator; a superfine channel is arranged in the chip radiator, the chip radiator is connected with a circulating pipe with a power device to form acirculating loop, and cooling liquid is filled in the circulating loop. According to the system provided by the invention, the semiconductor cooler and the chip radiator are combined to form a two-stage heat exchange system, the semiconductor cooler provides relatively large heat dissipation heat-flow density through actively transporting heat energy, heat on the chip can be absorbed in time, andthe chip radiator dissipates heat to the external environment via the circulating pipe; the system is heat in heat dissipation efficiency, low in cost, free of noise, controllable in cooling capacityand good in cooling effect.

Description

technical field [0001] The invention belongs to the field of chip cooling, and in particular relates to a chip cooling system. Background technique [0002] With the continuous improvement of electronic computer manufacturing technology and process level, computer microprocessors (CPU) are developing towards integration, miniaturization and high frequency, which at the same time lead to a sharp increase in equipment heat generation, and the problem of heat dissipation is becoming more and more serious. The heat dissipation problem of the chip is related to the stability of the equipment operation. Poor heat dissipation will lead to a serious decline in the performance of the computer, and affect the reliability of the product operation. It will seriously affect the use and life of other computer components. [0003] The traditional design adopts air-cooled heat dissipation, which has extremely low efficiency, high operating noise, and is limited by space; the heat dissipatio...

AI Technical Summary

Problems solved by technology

The heat dissipation problem of the chip is related to the stability of the equipment operation. Poor heat dissipation will lead to a serious decline in the performance of the computer and affect the reliability of the product operation. In severe cases, it will also affect the use and life of other components of the computer.

[0003] The traditional design scheme adopts air-cooled heat dissipation, which has extremely low efficiency, high operating noise, and is limited by space; the heat dissipation capacity of heat pipe cooling is limited; although the water cooling system has strong heat dissipation capacity and is very quiet, it needs a water pump to provide power, and the cost is relatively high. High, bulky, poor portability

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