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A temperature control system for mems devices

A temperature control system and device technology, applied in the field of sensors, can solve the problems that the temperature sensor cannot accurately measure the temperature of the device, cannot reflect the temperature difference between the upper substrate and the lower substrate, and the temperature performance temperature of the MEMS device, so as to improve the temperature performance and reduce the cost. , the effect of controllable structure size

Active Publication Date: 2020-06-30
XIAN FLIGHT SELF CONTROL INST OF AVIC
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  • Application Information

AI Technical Summary

Problems solved by technology

This method can improve the temperature performance of the MEMS device to a certain extent, but since the temperature sensor cannot accurately measure the temperature at the location of the device and cannot reflect the temperature difference between the upper substrate and the lower substrate, the MEMS device will still show temperature performance and temperature hysteresis

Method used

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  • A temperature control system for mems devices
  • A temperature control system for mems devices
  • A temperature control system for mems devices

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Embodiment Construction

[0017] Such as figure 1 As shown, the MEMS device structure of the present invention includes a sensitive layer structure 2, an upper substrate 3 and a lower substrate 1, and the sensitive layer structure is a movable structure prepared by wet etching or dry etching, and the structure can be Due to external acceleration, rotation, and pressure, a certain change in motion state occurs. This structure is the core structure for detecting the object to be measured. The above three-layer structure is prepared as a whole by bonding technology.

[0018] The upper substrate and the lower substrate of the MEMS device of the present invention all adopt MEMS process to prepare temperature detection electrodes, heating electrodes and signal detection electrodes, the temperature detection electrodes on the substrate are used to test the temperature of the substrate, and the heating electrodes are used to heat the substrate , the signal detection electrode is used for testing to obtain elec...

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Abstract

The invention belongs to the technical field of sensors, in particular to a temperature control system used for an MEMS device. The temperature control system is characterized in that temperature detection electrodes and heating electrodes are distributed on surfaces of upper and lower substrates of the MEMS device; and a temperature detection circuit transmits electric signals detected by means of the temperature detection electrodes to a signal processing circuit, the signal processing circuit judges whether operating temperatures of the surfaces of the upper and lower substrates of the MEMSdevice are appropriate, and the signal processing circuit controls the operating temperatures of the surfaces of the upper and lower substrates of the MEMS device through controlling intensities of control electric signals input to the heating electrodes. The temperature control system provided by the invention can eliminate temperature performance and temperature hysteresis of the MEMS device.

Description

technical field [0001] The invention belongs to the technical field of sensors, and in particular relates to a temperature control system for MEMS devices. Background technique [0002] Micro-electro-mechanical (MEMS) is an important technical field of high-tech development today. It is called micro-system (micro-system) and micro-machine (micro-machine) in Europe and Japan respectively. Photolithography, thin film sputtering, wet etching, dry etching, bonding and other microfabrication techniques have developed sensor devices or microsystems with feature sizes in the range of microns (1 μm to 1 mm). The rapid development of MEMS technology began in the late 1980s, especially after an important breakthrough was made in the preparation process of MEMS, its excellent performance has attracted widespread attention from all sides. Micro-accelerometers, micro-gyroscopes, micro-actuators, micro-optical switches, etc. developed based on MEMS technology have been used in aerospace,...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G05D23/30
CPCG05D23/30
Inventor 孙国良孙俊杰王小斌王刚牛昊彬余才佳
Owner XIAN FLIGHT SELF CONTROL INST OF AVIC
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