Eutectic Bi-Pb-Sn-Cd fusible alloy at temperature of 70 DEG C and method for preparing eutectic Bi-Pb-Sn-Cd fusible alloy
A fusible alloy, bi-pb-sn-cd technology, applied in the field of alloys, can solve problems such as insensitivity and inaccurate operating temperature, and achieve the effects of accurate melting point, accurate melting point operating temperature and good application prospects
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Embodiment 1
[0022] According to mass percentage, it consists of the following components: Bi 47%, Pb 25%, Sn 24% and Cd 4%. The preparation method includes: weighing Bi, Pb, Sn and Cd in proportion, using a high-frequency heating furnace to melt the alloy under the condition of pre-evacuation and then filling with argon, and controlling the melting temperature at 360°C to obtain Bi - Pb-Sn-Cd fusible alloy, denoted as Alloy 1.
Embodiment 2
[0024] According to mass percentage, it consists of the following components: Bi 54%, Pb 25%, Sn 15% and Cd 6%. The preparation method includes: weighing Bi, Pb, Sn and Cd in proportion, using a high-frequency heating furnace to melt the alloy under the condition of pre-evacuation and then filling with argon, and controlling the melting temperature at 360°C to obtain Bi - Pb-Sn-Cd fusible alloy, denoted as alloy 2.
Embodiment 3
[0026] According to mass percentage, it consists of the following components: Bi 57%, Pb 25%, Sn 9% and Cd 9%. The preparation method includes: weighing Bi, Pb, Sn and Cd in proportion, using a high-frequency heating furnace to melt the alloy under the condition of pre-evacuation and then filling with argon, and controlling the melting temperature at 360°C to obtain Bi -Pb-Sn-Cd fusible alloy, denoted as alloy 3.
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