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Mobile motherboard heat dissipation graphite sheet and mobile phone

A technology of graphite sheet and mobile phone, applied in the direction of telephone structure, cooling/ventilation/heating transformation, etc., can solve the problems of low strength, easy to be torn, cannot be reused, etc., so as to reduce production cost and improve bonding quality , The effect of solving the problem of sleepiness

Inactive Publication Date: 2018-01-23
SHANGHAI MANYU INFORMATION TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the existing graphite sheet structure is prone to trapped air during the assembly process. Air is trapped between the graphite sheet and the electronic product, which reduces the bonding quality of the graphite sheet and leads to thermal contact resistance between the graphite sheet and the electronic product. increase, thereby reducing the heat dissipation effect of the graphite sheet; when the trapped air is serious, the original graphite sheet needs to be torn off and re-applied, which reduces the production efficiency of electronic products; and because the graphite sheet is very thin, its strength is not high , is easily torn and basically cannot be used again, thus increasing the production cost of electronic products

Method used

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  • Mobile motherboard heat dissipation graphite sheet and mobile phone

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Embodiment Construction

[0017] In order to make the technical problems, technical solutions and advantages to be solved by the present invention clearer, the following will describe in detail with reference to the drawings and specific embodiments.

[0018] like figure 1 As shown, the embodiment of the present invention provides a kind of heat-dissipating graphite sheet for mobile phone motherboard, including graphite substrate 5, release film and between graphite substrate 5 and release film, a double-sided adhesive layer is provided, and it is characterized in that, also includes A font-shaped heat dissipation pipe 1, a number of inner fins 2 are evenly distributed in a symmetrical structure on the corresponding two sides of the pipe wall of the heat dissipation pipe 1, and the inner fins 2 are embedded in the graphite matrix 5, and the heat dissipation pipe 1 Wrapped outside the graphite matrix 5, the other corresponding two sides of the tube wall of the heat dissipation tube 1 are symmetrically d...

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Abstract

The present invention discloses a mobile motherboard heat dissipation graphite sheet. The sheet comprises a square-shaped heat-dissipating tube; a plurality of inner fins are symmetrically and uniformly distributed on two corresponding sides of the inner portion of the tube wall of the heat-dissipating tube; the inner fins are embedded in a graphite basal body; the heat-dissipating tube wraps thegraphite basal body; a plurality of external fins are symmetrically arranged on the other two opposite sides of the outer portion of the tube wall of the heat-dissipating tube; and the outer side of the tube wall of the heat-dissipating tube is uniformly coated with a spray layer. According to the mobile motherboard heat dissipation graphite sheet of the invention, aluminum alloy with high thermalconductivity is adopted; the inner wall and outer wall of the heat-dissipating tube are provided with the fins; the inner wall is in full contact with the graphite sheet, the heat dissipation area ofthe outer wall is large, and therefore, a heat dissipation rate can be greatly improved; and heat dissipation holes are formed in the graphite sheet, when the graphite sheet is bonded, air can be discharged easily through the heat dissipation holes, and therefore, air trapping can be avoided, the bonding quality of the graphite sheet and an electronic product is improved, and thus, the heat dissipation effect of the graphite sheet is improved, at the same time, assembly efficiency is improved, and production costs are reduced.

Description

technical field [0001] The invention relates to the technical field of mobile phone parts, in particular to a heat-dissipating graphite sheet for a main board of a mobile phone and a mobile phone. Background technique [0002] As electronic products such as mobile phones gradually turn to the development trend of thinner and lighter, the power consumption of chips is increasing, and the heat dissipation problem of electronic products is becoming more and more prominent. In order to improve the heat dissipation of electronic products, graphite sheets are widely used in the design of electronic products. The existing graphite sheet has a three-layer sandwich structure, which consists of graphite matrix, double-sided adhesive tape and release film from top to bottom. When assembling the graphite sheet, the release film is torn off first, and then the graphite sheet is pasted on the area of ​​the product to be dissipated. [0003] However, the existing graphite sheet structure...

Claims

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Application Information

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IPC IPC(8): H05K7/20H04M1/02
Inventor 顾元洪赖灿明
Owner SHANGHAI MANYU INFORMATION TECH CO LTD
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