High-temperature-resisting copolyamide hot melt adhesive for shoe material and processing method
A copolyamide and hot-melt adhesive technology, applied in the direction of polymer adhesive additives, adhesives, adhesive additives, etc., can solve the problem of low bonding strength, achieve high bonding strength, wide application range, and good flexibility Effect
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Embodiment 1
[0024] 120g of dimer acid, 10.6g of sebacic acid, and 45.7g of decanediamine were dropped into a 1000ml three-port reactor with a thermometer, a stirring bar, and a condensing tube at one time, and catalysts and additives were added. Increase the pressure and start stirring slowly. During the heating process, water will distill out. After the temperature rises to 200°C, use a vacuum pump to evacuate, the vacuum degree is <100Pa, keep stirring, and release the vacuum after 2 hours. Pour the molten copolyamide on the isolation On the paper, a long strip of glue was obtained, and after drying in an oven at 50°C for 24 hours, various tests were performed.
Embodiment 2
[0026] Put 120g of dimer acid, 10g of azelaic acid, and 45.7g of decanediamine into a 1000ml three-port reactor with a thermometer, a stirring bar, and a condensing tube at one time, add a catalyst, a small amount of auxiliary agent, and use normal pressure within 2 hours Heat up, start stirring slowly, water distills out during the heating process, after the temperature rises to 200°C, use a vacuum pump to evacuate, the vacuum degree is <100Pa, keep stirring, release the vacuum after 2 hours, and pour the melted copolyamide on the release paper After drying in an oven at 50°C for 24 hours, various tests were performed.
Embodiment 3
[0028] Put 120g of dimer acid, 11.3g of undecanedioic acid, and 30g of caprolactam into a 1000ml three-port reactor with a thermometer, a stirring bar, and a condenser at one time, add catalysts, small additives, and return to normal pressure within 2 hours Heat up, start stirring slowly, water distills out during the heating process, after the temperature rises to 200°C, use a vacuum pump to evacuate, the vacuum degree is <100Pa, keep stirring, release the vacuum after 2 hours, and pour the melted copolyamide on the release paper After drying in an oven at 50°C for 24 hours, various tests were performed.
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