Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Composite Magnetic Sealing Material

A sealing material and composite magnetic technology, which is applied in the direction of electrical components, electric solid devices, circuits, etc., can solve the problems of mold material interface peeling, electronic components or mold material cracks, etc., and achieve the effect of small thermal expansion coefficient and warpage prevention

Active Publication Date: 2017-12-08
TDK CORPARATION
View PDF5 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] On the other hand, since the difference in physical properties between the semiconductor IC and electronic components mounted on the substrate and the mold material also generates stress, various problems such as interface peeling of the mold material and cracks of the electronic component or mold material may occur. question

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Composite Magnetic Sealing Material
  • Composite Magnetic Sealing Material
  • Composite Magnetic Sealing Material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0083]

[0084] Resin materials were prepared by using the following preparations, that is, as the main ingredient, 830S (bisphenol A type epoxy resin) manufactured by DIC Corporation was used, and as the curing agent, 0.5 equivalents of Nippon Carbide Industries Co., DicyDD (dicyandiamide dicyandiamide) manufactured by Inc. used C11Z-CN (Imidazole imidazole) manufactured by Shikoku Chemical Industry Co., Ltd. (Japan) at 1 wt% as a curing accelerator relative to the main ingredient. 50% by volume, 70% by volume, or 70% by volume of Figure 17 The magnetic filler of the indicated composition was added to the above-mentioned resin material, and thoroughly kneaded to obtain a paste. Also, when it is not possible to make a paste, diethylene glycol butyl ether acetate (butyl carbitol acetate) is added at an appropriate time. This paste was applied to a thickness of approximately 300 μm, and thermally cured in the order of 100° C. for 1 hour, 130° C. for 1 hour, 150° C. for 1 hou...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Thermal expansion coefficientaaaaaaaaaa
Film thicknessaaaaaaaaaa
Volume resistivityaaaaaaaaaa
Login to View More

Abstract

Disclosed herein is a composite magnetic sealing material having a low thermal expansion coefficient. The composite magnetic sealing material includes a resin material and a filler blended in the resin material in a blended ratio of 30 vol. % or more to 85 vol. % or less. The filler includes a magnetic filler containing Fe and 32 wt. % or more and 39 wt. % or less of a metal material contained mainly of Ni, thereby the thermal expansion coefficient of the composite magnetic sealing material is 15 ppm / DEG C. or less.

Description

technical field [0001] The present invention relates to a composite magnetic sealing material, in particular to a composite magnetic sealing material most suitable as a molding material for electronic circuit packaging. Background technique [0002] In recent years, electronic devices such as smartphones have tended to adopt high-performance radio communication circuits and digital chips, and the operating frequency of semiconductor ICs used is also increasing. In addition, the system-in-package (SIP: system in package) with a 2.5D structure or a 3D structure that connects multiple semiconductor ICs with the shortest wiring is accelerating, and it can be predicted that the modularization of power supply system circuits will continue to increase in the future. . In addition, multiple electronic components can be predicted (passive components such as inductors, capacitors, resistors, and filters; active components such as transistors and diodes; integrated circuit components ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L23/29H01L23/552
CPCH01L23/552H01L23/295
Inventor 川畑贤一
Owner TDK CORPARATION
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com